Datasheet AD652 (Analog Devices) - 3

1.3 Absolute maximum ratings. 1/ Supply voltage (+VS to -VS) .. 36 V dc Open collector output voltage (above digital ground) .. 36 V dc Open collector output current .. 50 mA Lead temperature (soldering 10 seconds) ... 300C Maximum junction temperature (TJ) .. +160C Power dissipation (PD) ... 540 mW Storage temperature range ... -65C to +150C Thermal resistance junction-to-case (ΘJC) .. 25C/W Thermal resistance junction-to ambient (ΘJA) ... 100C/W 2/ 1.4 Recommended operating conditions. Supply voltage (±VS) ... ±6 V to ±15 V Ambient operating temperature range ... -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. ______ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Measurement taken under absolute worst case condition of still air while mounted above the printed circuit board (PCB) to minimize PCB mounting heat sink effects.
STANDARD
SIZE
5962-93222 MICROCIRCUIT DRAWING A
DLA LAND AND MARITIME REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 C 3 DSCC FORM 2234 APR 97