Datasheet ADXL212 (Analog Devices) - 5
| Fabricante | Analog Devices |
| Descripción | Low Cost ±2g Dual Axis Accelerometer |
| Páginas / Página | 13 / 5 — ADXL212. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 2. Parameter … |
| Formato / tamaño de archivo | PDF / 282 Kb |
| Idioma del documento | Inglés |
ADXL212. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 2. Parameter Rating. Table 3. Thermal Resistance. Package Type. θJA
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ADXL212 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2.
θ
Parameter Rating
JA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Acceleration (Any Axis, Unpowered) 1000 g Acceleration (Any Axis, Powered) 1000 g
Table 3. Thermal Resistance
VS −0.3 V to +7.0 V
Package Type θJA θJC Device Weight
Output Short-Circuit Duration Indefinite 8-Lead Ceramic LCC 120°C/W 20°C/W <1.0 g (Any Pin to Common) Operating Temperature Range −55°C to +125°C
ESD CAUTION
Storage Temperature Range −65°C to +150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
CRITICAL ZONE tP TL TO TP TP RAMP-UP TL T tL URE SMAX T A R E T P SMIN M TE tS PREHEAT RAMP-DOWN
2
t25°C TO PEAK
00 4-
TIME
80 09 Figure 2. Recommended Soldering Profile
Table 4. Soldering Profile Condition Profile Feature Sn63/Pb37 Pb Free
Average Ramp Rate (TL to TP) 3°C/sec maximum Preheat Minimum Temperature (TSMIN) 100°C 150°C Minimum Temperature (TSMAX) 150°C 200°C Time (TSMIN to TSMAX) (tS) 60 sec to 120 sec 60 sec to 150 sec TSMAX to TL Ramp-Up Rate 3°C/sec maximum Time (tL) Maintained Above Liquidous (TL) Liquidous Temperature (TL) 183°C 217°C Time (tL) 60 sec to 150 sec 60 sec to 150 sec Peak Temperature (TP) 240°C +0°C/–5°C 260°C +0°C/–5°C Time Within 5°C of Actual Peak Temperature (tP) 10 sec to 30 sec 20 sec to 40 sec Ramp-Down Rate 6°C/sec maximum Time 25°C to Peak Temperature 6 minutes maximum 8 minutes maximum Rev. 0 | Page 4 of 12 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION PERFORMANCE APPLICATIONS INFORMATION POWER SUPPLY DECOUPLING SETTING THE BANDWIDTH USING CX AND CY SELF TEST DESIGN TRADE-OFFS FOR SELECTING FILTER CHARACTERISTICS: NOISE vs. BANDWIDTH USING THE ADXL212 WITH OPERATING VOLTAGES OTHER THAN 5 V USING THE ADXL212 AS A DUAL AXIS TILT SENSOR Dual Axis Tilt Sensor: Converting Acceleration to Tilt OUTLINE DIMENSIONS ORDERING GUIDE
θ
Parameter Rating
JA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Acceleration (Any Axis, Unpowered) 1000 g Acceleration (Any Axis, Powered) 1000 g
Table 3. Thermal Resistance
VS −0.3 V to +7.0 V
Package Type θJA θJC Device Weight
Output Short-Circuit Duration Indefinite 8-Lead Ceramic LCC 120°C/W 20°C/W <1.0 g (Any Pin to Common) Operating Temperature Range −55°C to +125°C
ESD CAUTION
Storage Temperature Range −65°C to +150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
CRITICAL ZONE tP TL TO TP TP RAMP-UP TL T tL URE SMAX T A R E T P SMIN M TE tS PREHEAT RAMP-DOWN
2
t25°C TO PEAK
00 4-
TIME
80 09 Figure 2. Recommended Soldering Profile
Table 4. Soldering Profile Condition Profile Feature Sn63/Pb37 Pb Free
Average Ramp Rate (TL to TP) 3°C/sec maximum Preheat Minimum Temperature (TSMIN) 100°C 150°C Minimum Temperature (TSMAX) 150°C 200°C Time (TSMIN to TSMAX) (tS) 60 sec to 120 sec 60 sec to 150 sec TSMAX to TL Ramp-Up Rate 3°C/sec maximum Time (tL) Maintained Above Liquidous (TL) Liquidous Temperature (TL) 183°C 217°C Time (tL) 60 sec to 150 sec 60 sec to 150 sec Peak Temperature (TP) 240°C +0°C/–5°C 260°C +0°C/–5°C Time Within 5°C of Actual Peak Temperature (tP) 10 sec to 30 sec 20 sec to 40 sec Ramp-Down Rate 6°C/sec maximum Time 25°C to Peak Temperature 6 minutes maximum 8 minutes maximum Rev. 0 | Page 4 of 12 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION PERFORMANCE APPLICATIONS INFORMATION POWER SUPPLY DECOUPLING SETTING THE BANDWIDTH USING CX AND CY SELF TEST DESIGN TRADE-OFFS FOR SELECTING FILTER CHARACTERISTICS: NOISE vs. BANDWIDTH USING THE ADXL212 WITH OPERATING VOLTAGES OTHER THAN 5 V USING THE ADXL212 AS A DUAL AXIS TILT SENSOR Dual Axis Tilt Sensor: Converting Acceleration to Tilt OUTLINE DIMENSIONS ORDERING GUIDE