Datasheet ADXL372 (Analog Devices) - 7

FabricanteAnalog Devices
DescripciónMicropower, 3-Axis, ±200 g Digital Output, MEMS
Páginas / Página57 / 7 — ADXL372. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. RECOMMENDED …
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ADXL372. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. RECOMMENDED SOLDERING PROFILE. Parameter. Rating. CRITICAL ZONE. TL TO TP

ADXL372 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2 RECOMMENDED SOLDERING PROFILE Parameter Rating CRITICAL ZONE TL TO TP

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ADXL372 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. RECOMMENDED SOLDERING PROFILE Parameter Rating
Figure 2 and Table 4 provide details about the recommended Acceleration soldering profile. Any Axis, Unpowered 10000 g
CRITICAL ZONE t
Any Axis, Powered 10000 g
P TL TO TP TP
V
RAMP-UP
S −0.3 V to +3.6 V VDDI/O −0.3 V to +3.6 V
E TL T tL SMAX
All Other Pins −0.3 V to V
UR
S
T
Output Short-Circuit Duration (Any Pin to Indefinite
RA TSMIN
Ground)
EMPE T
ESD, Human Body Model (HBM) 2000 V
tS PREHEAT RAMP-DOWN
Temperature Range (Storage) −50°C to +150°C
t25°C TO PEAK
002 Stresses at or above those listed under Absolute Maximum
TIME
15430- Ratings may cause permanent damage to the product. This is a Figure 2. Recommended Soldering Profile stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational
Table 4. Recommended Soldering Profile
section of this specification is not implied. Operation beyond
Condition
the maximum operating conditions for extended periods may
Profile Feature Sn63/Pb37 Pb-Free
affect product reliability. Average Ramp Rate (TL to TP) 3°C/sec max 3°C/sec max Preheat
THERMAL RESISTANCE
Minimum Temperature (TSMIN) 100°C 150°C Thermal performance is directly linked to printed circuit board Maximum Temperature (TSMAX) 150°C 200°C Time (T 60 sec to (PCB) design and operating environment. Careful attention to SMIN to TSMAX) (tS) 60 sec to 120 sec 180 sec PCB thermal design is required. TSMAX to TL
Table 3.
Ramp-Up Rate 3°C/sec max 3°C/sec max Time Maintained Above
Package Type1 θJA θJC Unit Device Weight
Liquidous (TL) CC-16-4 150 85 °C/W 18 mg Liquidous Temperature (TL) 183°C 217°C 1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal Time (tL) 60 sec to 60 sec to test board with four thermal vias. See JEDEC JESD51. 150 sec 150 sec Peak Temperature (TP) 240 + 0/−5°C 260 + 0/−5°C Time Within 5°C of Actual Peak 10 sec to 30 sec 20 sec to 40 sec Temperature (tP) Ramp-Down Rate 6°C/sec max 6°C/sec max Time 25°C to Peak Temperature 6 minutes max 8 minutes max
ESD CAUTION
Rev. 0 | Page 6 of 56 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE RECOMMENDED SOLDERING PROFILE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION MECHANICAL DEVICE OPERATION OPERATING MODES Measurement Mode Instant On Mode Wake-Up Mode Standby BANDWIDTH Low-Pass Antialiasing Filter High-Pass Filter Filter Settling Time Selectable ODR POWER/NOISE TRADE-OFF POWER SAVINGS AUTONOMOUS EVENT DETECTION ACTIVITY AND INACTIVITY Low-Pass Activity Detect Filter Activity Detection Referenced and Absolute Configurations Activity Timer Activity Detection in Wake-Up Mode Inactivity Detection Referenced and Absolute Configurations Inactivity Timer Linking Activity and Inactivity Detection Default Mode Linked Mode Loop Mode Autosleep Using the AWAKE Bit MOTION WARNING IMPACT DETECTION FEATURES WIDE BANDWIDTH INSTANT ON IMPACT DETECTION CAPTURING IMPACT EVENTS FIFO BENEFITS OF THE FIFO System Level Power Savings Data Recording/Event Context USING THE FIFO FIFO Disabled Oldest Saved Mode (First N) Stream Mode (Last N) Triggered Mode RETRIEVING DATA FROM FIFO INTERRUPTS INTERRUPT PINS Alternate Functions TYPES OF INTERRUPTS Activity and Inactivity Interrupts Data Ready Interrupt FIFO Interrupts FIFO Watermark FIFO Ready Overrun ADDITIONAL FEATURES USING AN EXTERNAL CLOCK SYNCHRONIZED DATA SAMPLING SELF TEST Self Test Procedure USER REGISTER PROTECTION USER OFFSET TRIMS SERIAL COMMUNICATIONS SERIAL INTERFACE SPI Protocol I2C Protocol MULTIBYTE TRANSFERS INVALID ADDRESSES AND ADDRESS FOLDING SPI Timing Diagrams I2C Timing Diagrams REGISTER MAP REGISTER DETAILS ANALOG DEVICES ID REGISTER ANALOG DEVICES MEMS ID REGISTER DEVICE ID REGISTER PRODUCT REVISION ID REGISTER STATUS REGISTER ACTIVITY STATUS REGISTER FIFO ENTRIES REGISTER, MSB FIFO ENTRIES REGISTER, LSB X-AXIS DATA REGISTER, MSB X-AXIS DATA REGISTER, LSB Y-AXIS DATA REGISTER, MSB Y-AXIS DATA REGISTER, LSB Z-AXIS DATA REGISTER, MSB Z-AXIS DATA REGISTER, LSB HIGHEST PEAK DATA REGISTERS X-AXIS HIGHEST PEAK DATA REGISTER, MSB X-AXIS HIGHEST PEAK DATA REGISTER, LSB Y-AXIS HIGHEST PEAK DATA REGISTER, MSB Y-AXIS HIGHEST PEAK DATA REGISTER, LSB Z-AXIS HIGHEST PEAK DATA REGISTER, MSB Z-AXIS HIGHEST PEAK DATA REGISTER, LSB OFFSET TRIM REGISTERS X-AXIS OFFSET TRIM REGISTER, LSB Y-AXIS OFFSET TRIM REGISTER, LSB Z-AXIS OFFSET TRIM REGISTER, LSB X-AXIS ACTIVITY THRESHOLD REGISTER, MSB X-AXIS OF ACTIVITY THRESHOLD REGISTER, LSB Y-AXIS ACTIVITY THRESHOLD REGISTER, MSB Y-AXIS OF ACTIVITY THRESHOLD REGISTER, LSB Z-AXIS ACTIVITY THRESHOLD REGISTER, MSB Z-AXIS OF ACTIVITY THRESHOLD REGISTER, LSB ACTIVITY TIME REGISTER X-AXIS INACTIVITY THRESHOLD REGISTER, MSB X-AXIS OF INACTIVITY THRESHOLD REGISTER, LSB Y-AXIS INACTIVITY THRESHOLD REGISTER, MSB Y-AXIS OF INACTIVITY THRESHOLD REGISTER, LSB Z-AXIS INACTIVITY THRESHOLD REGISTER, MSB Z-AXIS OF INACTIVITY THRESHOLD REGISTER, LSB INACTIVITY TIME REGISTERS INACTIVITY TIMER REGISTER, MSB INACTIVITY TIMER REGISTER, LSB X-AXIS MOTION WARNING THRESHOLD REGISTER, MSB X-AXIS OF MOTION WARNING NOTIFICATION REGISTER, LSB Y-AXIS MOTION WARNING NOTIFICATION THRESHOLD REGISTER, MSB Y-AXIS OF MOTION WARNING NOTIFICATION REGISTER, LSB Z-AXIS MOTION WARNING NOTIFICATION THRESHOLD REGISTER, MSB Z-AXIS MOTION WARNING NOTIFICATION REGISTER, LSB HIGH-PASS FILTER SETTINGS REGISTER FIFO SAMPLES REGISTER FIFO CONTROL REGISTER INTERRUPT PIN FUNCTION MAP REGISTERS INT2 FUNCTION MAP REGISTER EXTERNAL TIMING CONTROL REGISTER MEASUREMENT CONTROL REGISTER POWER CONTROL REGISTER SELF TEST REGISTER RESET (CLEARS) REGISTER, PART IN STANDBY MODE FIFO ACCESS REGISTER APPLICATIONS INFORMATION APPLICATION EXAMPLES Power Supply Decoupling Using External Timing Triggers OPERATION AT VOLTAGES OTHER THAN 2.5 V OPERATION AT TEMPERATURES OTHER THAN AMBIENT MECHANICAL CONSIDERATIONS FOR MOUNTING AXES OF ACCELERATION SENSITIVITY LAYOUT AND DESIGN RECOMMENDATIONS OUTLINE DIMENSIONS ORDERING GUIDE