Datasheet ADXL356, ADXL357 (Analog Devices) - 8

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ADXL356/ADXL357 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 5. RECOMMENDED SOLDERING PROFILE Parameter Rating
Figure 5 and Table 7 provide details about the recommended Acceleration (Any Axis, 0.1 ms) 5000 g soldering profile. V , V 5.4 V SUPPLY DDIO
CRITICAL ZONE t
V , V Configured as Inputs 1.98 V
P TL TO TP T
1P8ANA 1P8DIG
P
ADXL356
RAMP-UP
Digital Inputs (RANGE, ST1, ST2, STBY) −0.3 V to V + 0.3 V
TL
DDIO
T tL URE SMAX
Analog Outputs (X , Y , Z , TEMP) −0.3 V to V + 0.3 V OUT OUT OUT 1P8ANA
RAT
ADXL357
E TSMIN P M
Digital Pins (CS/SCL, SCLK/V , −0.3 V to V + 0.3 V
E
SSIO DDIO
T t
MOSI/SDA, MISO/ASEL, INT1, INT2,
S PREHEAT RAMP-DOWN
DRDY) Operating Temperature Range −40°C to +125°C
t
005
25°C TO PEAK
Storage Temperature Range −55°C to +150°C
TIME
15429- Stresses at or above those listed under Absolute Maximum Figure 5. Recommended Soldering Profile Ratings may cause permanent damage to the product. This is a
Table 7. Recommended Soldering Profile
stress rating only; functional operation of the product at these
Condition
or any other conditions above those indicated in the operational
Profile Feature Sn63/Pb37 Pb-Free
section of this specification is not implied. Operation beyond Average Ramp Rate from Liquid 3°C/sec 3°C/sec the maximum operating conditions for extended periods may Temperature (T ) to Peak L maximum maximum affect product reliability. Temperature (T ) P
THERMAL RESISTANCE
Preheat Minimum Temperature 100°C 150°C Thermal performance is directly linked to printed circuit board (T ) SMIN (PCB) design and operating environment. Careful attention to Maximum Temperature 150°C 200°C PCB thermal design is required. (T ) SMAX θ Time from T to T (t ) 60 sec to 60 sec to JA is the natural convection junction to ambient thermal SMIN SMAX S resistance measured in a one cubic foot sealed enclosure. 120 sec 180 sec T to T Ramp-Up Rate 3°C/sec 3°C/sec SMAX L
Table 6. Thermal Resistance
maximum maximum
Package Type θ Unit
Liquid Temperature (T ) 183°C 217°C L
JA
E-14-11 42 °C/W Time Maintained Above T (t ) 60 sec to 60 sec to L L 150 sec 150 sec 1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal test board with four thermal vias. See JEDEC JESD51. Peak Temperature (T ) 240°C + 260°C + P 0°C/−5°C 0°C/−5°C Time of Actual T − 5°C (t ) 10 sec to 20 sec to P P 30 sec 40 sec Ramp-Down Rate 6°C/sec 6°C/sec maximum maximum Time from 25°C to Peak 6 minutes 8 minutes Temperature (t ) maximum maximum 25°C TO PEAK
ESD CAUTION
Rev. 0 | Page 8 of 42 Document Outline Features Applications Functional Block Diagrams General Description Revision History Specifications Analog Output for the ADXL356 Digital Output for the ADXL357 SPI Digital Interface Characteristics for the ADXL357 I2C Digital Interface Characteristics for the ADXL357 Absolute Maximum Ratings Thermal Resistance Recommended Soldering Profile ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Root Allan Variance (RAV) ADXL357 Characteristics Theory of Operation Applications Information Analog Output Digital Output Axes of Acceleration Sensitivity Power Sequencing Power Supply Description VSUPPLY V1P8ANA V1P8DIG VDDIO Overrange Protection Self Test Filter Serial Communications SPI Protocol I2C Protocol Reading Acceleration or Temperature Data from the Interface FIFO Interrupts DATA_RDY DRDY Pin FIFO_FULL FIFO_OVR Activity NVM_BUSY External Synchronization and Interpolation EXT_SYNC = 00—No External Sync or Interpolation EXT_SYNC = 10—External Sync with Interpolation EXT_SYNC = 01—External Sync and External Clock, No Interpolation Filter ADXL357 Register Map Register Definitions Analog Devices ID Register Address: 0x00, Reset: 0xAD, Name: DEVID_AD Analog Devices MEMS ID Register Address: 0x01, Reset: 0x1D, Name: DEVID_MST Device ID Register Address: 0x02, Reset: 0xED, Name: PARTID Product Revision ID Register Address: 0x03, Reset: 0x01, Name: REVID Status Register Address: 0x04, Reset: 0x00, Name: Status FIFO Entries Register Address: 0x05, Reset: 0x00, Name: FIFO_ENTRIES Temperature Data Registers Address: 0x06, Reset: 0x00, Name: TEMP2 Address: 0x07, Reset: 0x00, Name: TEMP1 X-Axis Data Registers Address: 0x08, Reset: 0x00, Name: XDATA3 Address: 0x09, Reset: 0x00, Name: XDATA2 Address: 0x0A, Reset: 0x00, Name: XDATA1 Y-Axis Data Registers Address: 0x0B, Reset: 0x00, Name: YDATA3 Address: 0x0C, Reset: 0x00, Name: YDATA2 Address: 0x0D, Reset: 0x00, Name: YDATA1 Z-Axis Data Registers Address: 0x0E, Reset: 0x00, Name: ZDATA3 Address: 0x0F, Reset: 0x00, Name: ZDATA2 Address: 0x10, Reset: 0x00, Name: ZDATA1 FIFO Access Register Address: 0x11, Reset: 0x00, Name: FIFO_DATA X-Axis Offset Trim Registers Address: 0x1E, Reset: 0x00, Name: OFFSET_X_H Address: 0x1F, Reset: 0x00, Name: OFFSET_X_L Y-Axis Offset Trim Registers Address: 0x20, Reset: 0x00, Name: OFFSET_Y_H Address: 0x21, Reset: 0x00, Name: OFFSET_Y_L Z-Axis Offset Trim Registers Address: 0x22, Reset: 0x00, Name: OFFSET_Z_H Address: 0x23, Reset: 0x00, Name: OFFSET_Z_L Activity Enable Register Address: 0x24, Reset: 0x00, Name: ACT_EN Activity Threshold Registers Address: 0x25, Reset: 0x00, Name: ACT_THRESH_H Address: 0x26, Reset: 0x00, Name: ACT_THRESH_L Activity Count Register Address: 0x27, Reset: 0x01, Name: ACT_COUNT Filter Settings Register Address: 0x28, Reset: 0x00, Name: Filter FIFO Samples Register Address: 0x29, Reset: 0x60, Name: FIFO_SAMPLES Interrupt Pin (INTx) Function Map Register Address: 0x2A, Reset: 0x00, Name: INT_MAP Data Synchronization Address: 0x2B, Reset: 0x00, Name: Sync I2C Speed, Interrupt Polarity, and Range Register Address: 0x2C, Reset: 0x81, Name: Range Power Control Register Address: 0x2D, Reset: 0x01, Name: POWER_CTL Self Test Register Address: 0x2E, Reset: 0x00, Name: SELF_TEST Reset Register Address: 0x2F, Reset: 0x00, Name: Reset PCB Footprint Pattern Outline Dimensions Ordering Guide