Datasheet DN3135 (Microchip) - 3

FabricanteMicrochip
DescripciónN-Channel Depletion-Mode Vertical DMOS FET
Páginas / Página12 / 3 — DN3135. AC ELECTRICAL CHARACTERISTICS 2. Electrical Specifications:. …
Formato / tamaño de archivoPDF / 667 Kb
Idioma del documentoInglés

DN3135. AC ELECTRICAL CHARACTERISTICS 2. Electrical Specifications:. Parameter. Sym. Min. Typ. Max. Unit. Conditions. DIODE PARAMETER. Note 1

DN3135 AC ELECTRICAL CHARACTERISTICS 2 Electrical Specifications: Parameter Sym Min Typ Max Unit Conditions DIODE PARAMETER Note 1

Línea de modelo para esta hoja de datos

Versión de texto del documento

link to page 3 link to page 3 link to page 2 link to page 3 link to page 2 link to page 2
DN3135 AC ELECTRICAL CHARACTERISTICS 2 Electrical Specifications:
Unless otherwise specified, for all specifications TA =TJ = +25°C.
Parameter Sym. Min. Typ. Max. Unit Conditions
Forward Transconductance GFS 140 — — mmho VDS = 10V, ID = 100 mA Input Capacitance CISS — 60 120 VGS = –5V,  Common Source Output C pF V OSS — 6 15 DS = 25V,  Capacitance f = 1 MHz Reverse Transfer Capacitance CRSS — 3 10 Turn-on Delay Time td(ON) — — 10 VDD = 25V,  Rise Time tr — — 15 I ns D = 150 mA,  Turn-off Delay Time t R d(OFF) — — 15 GEN = 25Ω,  VGS = 0V to –10V Fall Time tf — — 20
DIODE PARAMETER
V Diode Forward Voltage Drop V GS = –5V, ISD = 150 mA SD — — 1.8 V (
Note 1
) V Reverse Recovery Time t GS = –5V, ISD = 150 mA rr — 800 — ns (
Note 2
)
Note 1:
All DC parameters are 100% tested at 25°C unless otherwise stated. Pulse test: 300 µs pulse, 2% duty cycle.
2:
Specification is obtained by characterization and is not 100% tested.
TEMPERATURE SPECIFICATIONS Parameter Sym. Min. Typ. Max. Unit Conditions TEMPERATURE RANGE
Operating Ambient Temperature TA –55 — +150 °C Storage Temperature TS –55 — +150 °C
PACKAGE THERMAL RESISTANCE
SOT-23 JA — 203 — °C/W SOT-89 JA — 133 — °C/W
THERMAL CHARACTERISTICS I ( 1) D ID Power Dissipation at I ( 1) I Package (Continuous) (Pulsed) T DR DRM A = 25°C (mA) (mA) (mA) (mA) (W)
SOT-23 72 300 0.36 72 300 SOT-89 135 300 1.3(
2
) 135 300
Note 1:
ID (continuous) is limited by maximum TJ.
2:
Mounted on FR4 board, 25 mm x 25 mm x 1.57 mm  2017 Microchip Technology Inc. DS20005703A-page 3 Document Outline 1.0 Electrical Characteristics 2.0 Pin Description TABLE 2-1: Pin Function Table 3.0 Functional Description FIGURE 3-1: Switching Waveforms and Test Circuit. 4.0 Packaging Information 4.1 Package Marking Information Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MIC... Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, Media... ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, ... SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2017, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-1568-8 AMERICAS Corporate Office Atlanta Austin, TX Boston Chicago Dallas Detroit Houston, TX Indianapolis Los Angeles Raleigh, NC New York, NY San Jose, CA Canada - Toronto ASIA/PACIFIC Asia Pacific Office Hong Kong Australia - Sydney China - Beijing China - Chengdu China - Chongqing China - Dongguan China - Guangzhou China - Hangzhou China - Hong Kong SAR China - Nanjing China - Qingdao China - Shanghai China - Shenyang China - Shenzhen China - Wuhan China - Xian ASIA/PACIFIC China - Xiamen China - Zhuhai India - Bangalore India - New Delhi India - Pune Japan - Osaka Japan - Tokyo Korea - Daegu Korea - Seoul Malaysia - Kuala Lumpur Malaysia - Penang Philippines - Manila Singapore Taiwan - Hsin Chu Taiwan - Kaohsiung Taiwan - Taipei Thailand - Bangkok EUROPE Austria - Wels Denmark - Copenhagen Finland - Espoo France - Paris France - Saint Cloud Germany - Garching Germany - Heilbronn Germany - Karlsruhe Germany - Munich Germany - Rosenheim Israel - Ra’anana Italy - Milan Italy - Padova Netherlands - Drunen Norway - Trondheim Spain - Madrid Sweden - Gothenberg UK - Wokingham