Datasheet DN1509 (Microchip) - 8
| Fabricante | Microchip |
| Descripción | N-Channel, Depletion-Mode, Vertical DMOS FET |
| Páginas / Página | 12 / 8 — DN1509. 5-Lead SOT-23 Package Outline (K1) 2.90x1.60mm body, 1.45mm … |
| Formato / tamaño de archivo | PDF / 645 Kb |
| Idioma del documento | Inglés |
DN1509. 5-Lead SOT-23 Package Outline (K1) 2.90x1.60mm body, 1.45mm height (max), 0.95mm pitch. Top View. View B. Side View
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DN1509 5-Lead SOT-23 Package Outline (K1) 2.90x1.60mm body, 1.45mm height (max), 0.95mm pitch
D θ1 e1 5 E1 E Gauge Note 1 L2 (Index Area Plane D/2 x E1/2) 1 e L Seating b θ Plane L1
Top View View B
View B A A A2 Seating Plane A1
Side View
A
View A - A
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
Note:
1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEHDPROGHGPDUNLGHQWL¿HUDQHPEHGGHGPHWDOPDUNHURU a printed indicator.
Symbol A A1 A2 b D E E1 e e1 L L1 L2 ș ș
MIN 0.90* 0.00 0.90 0.30 2.75* 2.60* 1.45* 0.30 0O 5O Dimension 0.95 1.90 0.60 0.25 NOM - - 1.15 - 2.90 2.80 1.60 0.45 4O 10O (mm) BSC BSC REF BSC MAX 1.45 0.15 1.30 0.50 3.05* 3.00* 1.75* 0.60 8O 15O JEDEC Registration MO-178, Variation AA, Issue C, Feb. 2000. 7KLVGLPHQVLRQLVQRWVSHFL¿HGLQWKH-('(&GUDZLQJ
Drawings not to scale.
DS20005403B-page 8 2015 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics 1.1 Electrical Specifications TABLE 1-1: DC and AC Characteristics TABLE 1-2: Typical Thermal Resistance TABLE 1-3: Thermal characteristics 2.0 Pin Description TABLE 2-1: Pin Description 3.0 Application Information FIGURE 3-1: Switching Waveforms and Test Circuit 4.0 Packaging Information 4.1 Package Marking Information AMERICAS Corporate Office Atlanta Austin, TX Boston Chicago Cleveland Dallas Detroit Houston, TX Indianapolis Los Angeles New York, NY San Jose, CA Canada - Toronto ASIA/PACIFIC Asia Pacific Office Hong Kong Australia - Sydney China - Beijing China - Chengdu China - Chongqing China - Dongguan China - Hangzhou China - Hong Kong SAR China - Nanjing China - Qingdao China - Shanghai China - Shenyang China - Shenzhen China - Wuhan China - Xian ASIA/PACIFIC China - Xiamen China - Zhuhai India - Bangalore India - New Delhi India - Pune Japan - Osaka Japan - Tokyo Korea - Daegu Korea - Seoul Malaysia - Kuala Lumpur Malaysia - Penang Philippines - Manila Singapore Taiwan - Hsin Chu Taiwan - Kaohsiung Taiwan - Taipei Thailand - Bangkok EUROPE Austria - Wels Denmark - Copenhagen France - Paris Germany - Dusseldorf Germany - Karlsruhe Germany - Munich Italy - Milan Italy - Venice Netherlands - Drunen Poland - Warsaw Spain - Madrid Sweden - Stockholm UK - Wokingham
D θ1 e1 5 E1 E Gauge Note 1 L2 (Index Area Plane D/2 x E1/2) 1 e L Seating b θ Plane L1
Top View View B
View B A A A2 Seating Plane A1
Side View
A
View A - A
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
Note:
1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEHDPROGHGPDUNLGHQWL¿HUDQHPEHGGHGPHWDOPDUNHURU a printed indicator.
Symbol A A1 A2 b D E E1 e e1 L L1 L2 ș ș
MIN 0.90* 0.00 0.90 0.30 2.75* 2.60* 1.45* 0.30 0O 5O Dimension 0.95 1.90 0.60 0.25 NOM - - 1.15 - 2.90 2.80 1.60 0.45 4O 10O (mm) BSC BSC REF BSC MAX 1.45 0.15 1.30 0.50 3.05* 3.00* 1.75* 0.60 8O 15O JEDEC Registration MO-178, Variation AA, Issue C, Feb. 2000. 7KLVGLPHQVLRQLVQRWVSHFL¿HGLQWKH-('(&GUDZLQJ
Drawings not to scale.
DS20005403B-page 8 2015 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics 1.1 Electrical Specifications TABLE 1-1: DC and AC Characteristics TABLE 1-2: Typical Thermal Resistance TABLE 1-3: Thermal characteristics 2.0 Pin Description TABLE 2-1: Pin Description 3.0 Application Information FIGURE 3-1: Switching Waveforms and Test Circuit 4.0 Packaging Information 4.1 Package Marking Information AMERICAS Corporate Office Atlanta Austin, TX Boston Chicago Cleveland Dallas Detroit Houston, TX Indianapolis Los Angeles New York, NY San Jose, CA Canada - Toronto ASIA/PACIFIC Asia Pacific Office Hong Kong Australia - Sydney China - Beijing China - Chengdu China - Chongqing China - Dongguan China - Hangzhou China - Hong Kong SAR China - Nanjing China - Qingdao China - Shanghai China - Shenyang China - Shenzhen China - Wuhan China - Xian ASIA/PACIFIC China - Xiamen China - Zhuhai India - Bangalore India - New Delhi India - Pune Japan - Osaka Japan - Tokyo Korea - Daegu Korea - Seoul Malaysia - Kuala Lumpur Malaysia - Penang Philippines - Manila Singapore Taiwan - Hsin Chu Taiwan - Kaohsiung Taiwan - Taipei Thailand - Bangkok EUROPE Austria - Wels Denmark - Copenhagen France - Paris Germany - Dusseldorf Germany - Karlsruhe Germany - Munich Italy - Milan Italy - Venice Netherlands - Drunen Poland - Warsaw Spain - Madrid Sweden - Stockholm UK - Wokingham