Datasheet MCP4725 (Microchip) - 3

FabricanteMicrochip
Descripción12-Bit Digital-to-Analog Converter with EEPROM Memory in SOT-23-6
Páginas / Página50 / 3 — MCP4725. 1.0. ELECTRICAL. † Notice:. CHARACTERISTICS. Absolute Maximum …
Formato / tamaño de archivoPDF / 1.5 Mb
Idioma del documentoInglés

MCP4725. 1.0. ELECTRICAL. † Notice:. CHARACTERISTICS. Absolute Maximum Ratings†. ELECTRICAL CHARACTERISTICS

MCP4725 1.0 ELECTRICAL † Notice: CHARACTERISTICS Absolute Maximum Ratings† ELECTRICAL CHARACTERISTICS

Línea de modelo para esta hoja de datos

Versión de texto del documento

link to page 3 link to page 3 link to page 3 link to page 3
MCP4725 1.0 ELECTRICAL † Notice:
Stresses above those listed under “Maximum
CHARACTERISTICS
ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the
Absolute Maximum Ratings†
operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect VDD...6.5V device reliability All inputs and outputs w.r.t VSS ...–0.3V to VDD+0.3V Current at Input Pins ..±2 mA Current at Supply Pins ...±50 mA Current at Output Pins ...±25 mA Storage Temperature ...-65°C to +150°C Ambient Temp. with Power Applied ...-55°C to +125°C ESD protection on all pins .. ≥ 6 kV HBM, ≥ 400V MM Maximum Junction Temperature (TJ) ... +150°C
ELECTRICAL CHARACTERISTICS Electrical Specifications:
Unless otherwise indicated, all parameters apply at VDD = + 2.7V to 5.5V, VSS = 0V, RL = 5 kΩ from VOUT to VSS, CL = 100 pF, TA = -40°C to +125°C. Typical values are at +25°C.
Parameter Sym Min Typ Max Units Conditions Power Requirements
Operating Voltage VDD 2.7 5.5 V Supply Current IDD — 210 400 µA Digital input pins are grounded, Output pin (VOUT) is not connected (unloaded), Code = 000h Power-Down Current IDDP — 0.06 2.0 µA VDD = 5.5V Power-On-Reset VPOR — 2 — V Threshold Voltage
DC Accuracy
Resolution n 12 — — Bits Code Range = 000h to FFFh INL Error INL — ±2 ±14.5 LSB
Note 1
DNL DNL -0.75 ±0.2 ±0.75 LSB
Note 1
Offset Error VOS 0.02 0.75 % of FSR Code = 000h Offset Error Drift ΔVOS/°C — ±1 — ppm/°C -45°C to +25°C — ±2 — ppm/°C +25°C to +85°C Gain Error GE -2 -0.1 2 % of FSR Code = FFFh, Offset error is not included. Gain Error Drift ΔGE/°C — -3 — ppm/°C
Output Amplifier
Phase Margin pM — 66 — Degree(°) CL = 400 pF, RL = ∞ Capacitive Load Stability CL — — 1000 pF RL = 5 kΩ,
Note 2
Slew Rate SR — 0.55 — V/µs Short Circuit Current ISC — 15 24 mA VDD = 5V, VOUT = Grounded Output Voltage Settling TS — 6 — µs
Note 3
Time
Note 1:
Test Code Range: 100 to 4000.
2:
This parameter is ensure by design and not 100% tested.
3:
Within 1/2 LSB of the final value when code changes from 1/4 to 3/4 (400h to C00h) of full scale range.
4:
Logic state of external address selection pin (A0 pin). © 2009 Microchip Technology Inc. DS22039D-page 3 Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves FIGURE 2-1: DNL vs. Code (VDD = 5.5V). FIGURE 2-2: DNL vs. Code and Temperature (TA = -40°C to +125°C). FIGURE 2-3: DNL vs. Code (VDD = 2.7V). FIGURE 2-4: DNL vs. Code and Temperature (TA = -40°C to +125°C). FIGURE 2-5: INL vs. Code. FIGURE 2-6: INL vs. Code and Temperature (VDD = 5.5V). FIGURE 2-7: INL vs. Code and Temperature (VDD = 2.7V). FIGURE 2-8: Zero Scale Error vs. Temperature (Code = 000d). FIGURE 2-9: Full Scale Error vs. Temperature (Code = 4095d). FIGURE 2-10: Output Error vs. Temperature (Code = 4000d). FIGURE 2-11: IDD vs. Temperature. FIGURE 2-12: IDD Histogram . FIGURE 2-13: IDD Histogram. FIGURE 2-14: Offset Error vs. Temperature and VDD. FIGURE 2-15: VOUT vs. Resistive Load. FIGURE 2-16: Source and Sink Current Capability. FIGURE 2-17: VIN High Threshold vs. Temperature and VDD. FIGURE 2-18: VIN Low Threshold vs. Temperature and VDD. FIGURE 2-19: Full Scale Settling Time. FIGURE 2-20: Full Scale Settling Time. FIGURE 2-21: Half Scale Settling Time. FIGURE 2-22: Half Scale Settling Time. FIGURE 2-23: Code Change Glitch. FIGURE 2-24: Exiting Power Down Mode. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Output Voltage (VOUT) 3.2 Supply Voltage (VDD or VSS) 3.3 Serial Data Pin (SDA) 3.4 Serial Clock Pin (SCL) 3.5 Device Address Selection Pin (A0) 4.0 Terminology 4.1 Resolution 4.2 LSB 4.3 Integral Nonlinearity (INL) or Relative Accuracy FIGURE 4-1: INL Accuracy. 4.4 Differential Nonlinearity (DNL) FIGURE 4-2: DNL Accuracy. 4.5 Offset Error FIGURE 4-3: Offset Error. 4.6 Gain Error 4.7 Full Scale Error (FSE) FIGURE 4-4: Gain Error and Full Scale Error. 4.8 Gain Error Drift 4.9 Offset Error Drift 4.10 Settling Time 4.11 Major-Code Transition Glitch 4.12 Digital Feedthrough 5.0 General Description 5.1 Output Voltage 5.2 LSB SIZE TABLE 5-1: LSB SIZES for MCP4725 (example) 5.3 Voltage Reference 5.4 Reset Conditions 5.5 Normal and Power-Down Modes TABLE 5-2: Power-down bits FIGURE 5-1: Output Stage for Power- Down Mode. 5.6 Non-Volatile EEPROM Memory TABLE 5-3: EEPROM Memory and Factory Default Settings (Total number of bits: 14 bits) TABLE 5-4: DAC register 6.0 Theory Of Operation 6.1 Write Commands TABLE 6-1: Input Data Coding TABLE 6-2: Write Command Type FIGURE 6-1: Fast Mode Write Command. FIGURE 6-2: Write Commands for DAC Input Register and EEPROM. 6.2 read command FIGURE 6-3: Read Command and Output Data Format. 7.0 I2C Serial Interface Communication 7.1 OVERVIEW 7.2 Device Addressing FIGURE 7-1: Device Addressing. 7.3 General Call FIGURE 7-2: General Call Address Format. 7.4 High-Speed (HS) Mode 7.5 I2C BUS CHARACTERISTICS FIGURE 7-3: Data Transfer Sequence On The Serial Bus. TABLE 7-1: I2c serial timing Specifications FIGURE 7-4: I2C Bus Timing Data. 8.0 Typical Applications 8.1 Connecting to I2C BUS using Pull-Up Resistors FIGURE 8-1: I2C Bus Interface Connection with A0 pin tied to VSS. FIGURE 8-2: I2C Bus Connection Test. 8.2 Using Non-Volatile EEPROM Memory 8.3 Power Supply Considerations 8.4 Layout Considerations 8.5 Application Examples FIGURE 8-3: Digitally Controllable Current Source. 9.0 Development Support 9.1 Evaluation & Demonstration Boards FIGURE 9-1: MCP4725 SOT-23-6 Evaluation Board. FIGURE 9-2: Setup for the MCP4725 SOT-23-6 Evaluation Board with PICkit™ Serial Analyzer. FIGURE 9-3: Example of PICkit™ Serial User Interface. 10.0 Packaging Information 10.1 Package Marking Information Corporate Office Atlanta Boston Chicago Cleveland Fax: 216-447-0643 Dallas Detroit Kokomo Toronto Fax: 852-2401-3431 Australia - Sydney China - Beijing China - Shanghai India - Bangalore Korea - Daegu Korea - Seoul Singapore Taiwan - Taipei Fax: 43-7242-2244-393 Denmark - Copenhagen France - Paris Germany - Munich Italy - Milan Spain - Madrid UK - Wokingham Worldwide Sales and Service