Datasheet Summary SAM D21E, SAM D21G, SAM D21J (Microchip) - 3

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Table of Contents
Introduction..1 Features.. 1 1. Description...5 2. Configuration Summary...6 3. Ordering Information..8 3.1. SAM D21E..8 3.2. SAM D21G... 11 3.3. SAM D21J.. 13 3.4. Device Identification... 15 4. Block Diagram... 17 5. Pinout.. 18 5.1. SAM D21J.. 18 5.2. SAM D21G... 20 5.3. SAM D21E..22 6. Product Mapping... 24 7. Processor And Architecture...25 7.1. Cortex M0+ Processor... 25 7.2. Nested Vector Interrupt Controller..26 7.3. Micro Trace Buffer.. 28 7.4. High-Speed Bus System.. 29 7.5. AHB-APB Bridge.. 31 7.6. PAC - Peripheral Access Controller... 32 8. Packaging Information...43 8.1. Thermal Considerations... 43 8.2. Package Drawings... 44 8.3. Soldering Profile... 55 The Microchip Web Site.. 56 Customer Change Notification Service..56 Customer Support... 56 Product Identification System..56 Microchip Devices Code Protection Feature... 57 Legal Notice...57 © 2017 Microchip Technology Inc.
Datasheet Summary
40001884A-page 3 Document Outline Introduction Features Table of Contents 1. Description 2. Configuration Summary 3. Ordering Information 3.1. SAM D21E 3.2. SAM D21G 3.3. SAM D21J 3.4. Device Identification 4. Block Diagram 5. Pinout 5.1. SAM D21J 5.1.1. QFN64 / TQFP64 5.1.2. UFBGA64 5.2. SAM D21G 5.2.1. QFN48 / TQFP48 5.2.2. WLCSP45 5.3. SAM D21E 5.3.1. QFN32 / TQFP32 5.3.2. WLCSP35 6. Product Mapping 7. Processor And Architecture 7.1. Cortex M0+ Processor 7.1.1. Cortex M0+ Configuration 7.1.2. Cortex-M0+ Peripherals 7.1.3. Cortex-M0+ Address Map 7.1.4. I/O Interface 7.1.4.1. Overview 7.1.4.2. Description 7.2. Nested Vector Interrupt Controller 7.2.1. Overview 7.2.2. Interrupt Line Mapping 7.3. Micro Trace Buffer 7.3.1. Features 7.3.2. Overview 7.4. High-Speed Bus System 7.4.1. Features 7.4.2. Configuration 7.4.3. SRAM Quality of Service 7.5. AHB-APB Bridge 7.6. PAC - Peripheral Access Controller 7.6.1. Overview 7.6.2. Register Description 7.6.2.1. PAC0 Register Description 7.6.2.1.1. Write Protect Clear 7.6.2.1.2. Write Protect Set 7.6.2.2. PAC1 Register Description 7.6.2.2.1. Write Protect Clear 7.6.2.2.2. Write Protect Set 7.6.2.3. PAC2 Register Description 7.6.2.3.1. Write Protect Clear 7.6.2.3.2. Write Protect Set 8. Packaging Information 8.1. Thermal Considerations 8.1.1. Thermal Resistance Data 8.1.2. Junction Temperature 8.2. Package Drawings 8.2.1. 64 pin TQFP 8.2.2. 64 pin QFN 8.2.3. 64-ball UFBGA 8.2.4. 48 pin TQFP 8.2.5. 48 pin QFN 8.2.6. 45-ball WLCSP 8.2.7. 32 pin TQFP 8.2.8. 32 pin QFN 8.2.9. 35 ball WLCSP (Device Variant B) 8.2.10. 35 ball WLCSP (Device Variant C) 8.3. Soldering Profile The Microchip Web Site Customer Change Notification Service Customer Support Product Identification System Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Certified by DNV Worldwide Sales and Service