Datasheet Summary SAM D21E, SAM D21G, SAM D21J (Microchip) - 2

32-bit ARM-Based Microcontrollers
• Up to four compare channels with optional complementary output • Generation of synchronized pulse width modulation (PWM) pattern across port pins • Deterministic fault protection, fast decay and configurable dead-time between complementary output • Dithering that increase resolution with up to 5 bit and reduce quantization error – 32-bit Real Time Counter (RTC) with clock/calendar function – Watchdog Timer (WDT) – CRC-32 generator – One full-speed (12Mbps) Universal Serial Bus (USB) 2.0 interface • Embedded host and device function • Eight endpoints – Up to six Serial Communication Interfaces (SERCOM), each configurable to operate as either: • USART with full-duplex and single-wire half-duplex configuration • I2C up to 3.4MHz • SPI • LIN slave – One two-channel Inter-IC Sound (I2S) interface – One 12-bit, 350ksps Analog-to-Digital Converter (ADC) with up to 20 channels • Differential and single-ended input • 1/2x to 16x programmable gain stage • Automatic offset and gain error compensation • Oversampling and decimation in hardware to support 13-, 14-, 15- or 16-bit resolution – 10-bit, 350ksps Digital-to-Analog Converter (DAC) – Two Analog Comparators (AC) with window compare function – Peripheral Touch Controller (PTC) • 256-Channel capacitive touch and proximity sensing • I/O – Up to 52 programmable I/O pins • Drop in compatible with SAM D20 • Packages – 64-pin TQFP, QFN, UFBGA – 48-pin TQFP, QFN, WLCSP – 32-pin TQFP, QFN, WLCSP • Operating Voltage – 1.62V – 3.63V © 2017 Microchip Technology Inc.
Datasheet Summary
40001884A-page 2 Document Outline Introduction Features Table of Contents 1. Description 2. Configuration Summary 3. Ordering Information 3.1. SAM D21E 3.2. SAM D21G 3.3. SAM D21J 3.4. Device Identification 4. Block Diagram 5. Pinout 5.1. SAM D21J 5.1.1. QFN64 / TQFP64 5.1.2. UFBGA64 5.2. SAM D21G 5.2.1. QFN48 / TQFP48 5.2.2. WLCSP45 5.3. SAM D21E 5.3.1. QFN32 / TQFP32 5.3.2. WLCSP35 6. Product Mapping 7. Processor And Architecture 7.1. Cortex M0+ Processor 7.1.1. Cortex M0+ Configuration 7.1.2. Cortex-M0+ Peripherals 7.1.3. Cortex-M0+ Address Map 7.1.4. I/O Interface 7.1.4.1. Overview 7.1.4.2. Description 7.2. Nested Vector Interrupt Controller 7.2.1. Overview 7.2.2. Interrupt Line Mapping 7.3. Micro Trace Buffer 7.3.1. Features 7.3.2. Overview 7.4. High-Speed Bus System 7.4.1. Features 7.4.2. Configuration 7.4.3. SRAM Quality of Service 7.5. AHB-APB Bridge 7.6. PAC - Peripheral Access Controller 7.6.1. Overview 7.6.2. Register Description 7.6.2.1. PAC0 Register Description 7.6.2.1.1. Write Protect Clear 7.6.2.1.2. Write Protect Set 7.6.2.2. PAC1 Register Description 7.6.2.2.1. Write Protect Clear 7.6.2.2.2. Write Protect Set 7.6.2.3. PAC2 Register Description 7.6.2.3.1. Write Protect Clear 7.6.2.3.2. Write Protect Set 8. Packaging Information 8.1. Thermal Considerations 8.1.1. Thermal Resistance Data 8.1.2. Junction Temperature 8.2. Package Drawings 8.2.1. 64 pin TQFP 8.2.2. 64 pin QFN 8.2.3. 64-ball UFBGA 8.2.4. 48 pin TQFP 8.2.5. 48 pin QFN 8.2.6. 45-ball WLCSP 8.2.7. 32 pin TQFP 8.2.8. 32 pin QFN 8.2.9. 35 ball WLCSP (Device Variant B) 8.2.10. 35 ball WLCSP (Device Variant C) 8.3. Soldering Profile The Microchip Web Site Customer Change Notification Service Customer Support Product Identification System Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Certified by DNV Worldwide Sales and Service