Datasheet ADA4858-3 (Analog Devices) - 6
| Fabricante | Analog Devices |
| Descripción | Single-Supply, High Speed, Triple Op Amp with Charge Pump |
| Páginas / Página | 21 / 6 — Data Sheet. ADA4858-3. ABSOLUTE MAXIMUM RATINGS. MAXIMUM POWER … |
| Revisión | B |
| Formato / tamaño de archivo | PDF / 407 Kb |
| Idioma del documento | Inglés |
Data Sheet. ADA4858-3. ABSOLUTE MAXIMUM RATINGS. MAXIMUM POWER DISSIPATION. Table 3. Parameter. Rating. 2.5. 2.0. IO T. 1.5. ISSI D. ER W. 1.0
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Data Sheet ADA4858-3 ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION Table 3. Parameter Rating
The maximum power that can be safely dissipated by the Supply Voltage 6 V ADA4858-3 is limited by the associated rise in junction Internal Power Dissipation1 temperature. The maximum safe junction temperature for 16-Lead LFCSP See Figure 2 plastic encapsulated devices is determined by the glass transition Input Voltage (Common Mode) (−V − 0.2 V) to (+V − 1.2 V) temperature of the plastic, approximately 150°C. Temporarily S S Differential Input Voltage ±V exceeding this limit may cause a shift in parametric performance S Output Short-Circuit Duration Observe power derating curves due to a change in the stresses exerted on the die by the package. Storage Temperature Range −65°C to +125°C Exceeding a junction temperature of 175°C for an extended Operating Temperature Range −40°C to +105°C period can result in device failure. Lead Temperature 300°C To ensure proper operation, it is necessary to observe the (Soldering, 10 sec) maximum power derating curves in Figure 2. 1 Specification is for device in free air.
2.5
Stresses above those listed under Absolute Maximum Ratings
)
may cause permanent damage to the device. This is a stress
(W 2.0 N
rating only; functional operation of the device at these or any
IO T
other conditions above those indicated in the operational
PA 1.5
section of this specification is not implied. Exposure to absolute
ISSI D
maximum rating conditions for extended periods may affect
ER W
device reliability.
1.0 M PO MU XI 0.5 MA 0 –40 –20 0 20 40 60 80 100
002
AMBIENT TEMPERATURE (°C)
07714- Figure 2. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
Rev. B | Page 5 of 20 Document Outline Features Applications General Description Connection Diagram Table of Contents Revision History Specifications Absolute Maximum Ratings Maximum Power Dissipation ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Overview Charge Pump Operation Applications Information Gain Configurations DC-Coupled Video Signal Multiple Video Driver DC Restore Function Clamp Amplifier PD (Power-Down) Pin Power Supply Bypassing Layout Outline Dimensions Ordering Guide
Data Sheet ADA4858-3 ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION Table 3. Parameter Rating
The maximum power that can be safely dissipated by the Supply Voltage 6 V ADA4858-3 is limited by the associated rise in junction Internal Power Dissipation1 temperature. The maximum safe junction temperature for 16-Lead LFCSP See Figure 2 plastic encapsulated devices is determined by the glass transition Input Voltage (Common Mode) (−V − 0.2 V) to (+V − 1.2 V) temperature of the plastic, approximately 150°C. Temporarily S S Differential Input Voltage ±V exceeding this limit may cause a shift in parametric performance S Output Short-Circuit Duration Observe power derating curves due to a change in the stresses exerted on the die by the package. Storage Temperature Range −65°C to +125°C Exceeding a junction temperature of 175°C for an extended Operating Temperature Range −40°C to +105°C period can result in device failure. Lead Temperature 300°C To ensure proper operation, it is necessary to observe the (Soldering, 10 sec) maximum power derating curves in Figure 2. 1 Specification is for device in free air.
2.5
Stresses above those listed under Absolute Maximum Ratings
)
may cause permanent damage to the device. This is a stress
(W 2.0 N
rating only; functional operation of the device at these or any
IO T
other conditions above those indicated in the operational
PA 1.5
section of this specification is not implied. Exposure to absolute
ISSI D
maximum rating conditions for extended periods may affect
ER W
device reliability.
1.0 M PO MU XI 0.5 MA 0 –40 –20 0 20 40 60 80 100
002
AMBIENT TEMPERATURE (°C)
07714- Figure 2. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
Rev. B | Page 5 of 20 Document Outline Features Applications General Description Connection Diagram Table of Contents Revision History Specifications Absolute Maximum Ratings Maximum Power Dissipation ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Overview Charge Pump Operation Applications Information Gain Configurations DC-Coupled Video Signal Multiple Video Driver DC Restore Function Clamp Amplifier PD (Power-Down) Pin Power Supply Bypassing Layout Outline Dimensions Ordering Guide