Datasheet ADA4805-2-EP (Analog Devices) - 6

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ADA4805-2-EP Enhanced Product ABSOLUTE MAXIMUM RATINGS Table 5.
The quiescent power dissipation is the voltage between the supply
Parameter Rating
pins (VS) multiplied by the quiescent current (IS). Supply Voltage 11 V PD = Quiescent Power + (Total Drive Power − Load Power) Power Dissipation See Figure 3  V V  V 2 Common-Mode Input Voltage −V = × + × − D P (V I ) S OUT OUT S − 0.7 V to +VS + 0.7 V S S   Differential Input Voltage ±1 V  2 RL  RL Storage Temperature Range −65°C to +125°C RMS output voltages must be considered. If RL is referenced Operating Temperature Range −55°C to +125°C to −VS, as in single-supply operation, the total drive power is Lead Temperature (Soldering, 10 sec) 300°C VS × IOUT. If the rms signal levels are indeterminate, consider the Junction Temperature 150°C worst case, when VOUT = VS/4 for RL to midsupply. Stresses at or above those listed under Absolute Maximum V 2 / 4 P = V × I + D ( S S ) ( S ) Ratings may cause permanent damage to the product. This is a RL stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational In single-supply operation with RL referenced to −VS, worst case section of this specification is not implied. Operation beyond is VOUT = VS/2. the maximum operating conditions for extended periods may Airflow increases heat dissipation, effectively reducing θJA. Also, affect product reliability. more metal directly in contact with the package leads and exposed
THERMAL RESISTANCE
pad from metal traces, through holes, ground, and power planes reduces θJA. θJA is specified for the worst case conditions, that is, θJA is specified for a device soldered in a circuit board for surface-mount packages. Figure 3 shows the maximum safe power dissipation in the Table 6 lists the θ package vs. the ambient temperature on a JEDEC standard, JA for the ADA4805-2-EP. 4-layer board. θJA values are approximations.
Table 6. Thermal Resistance 2.0 T Package Type θ J = 150°C JA Unit
8-Lead MSOP 123.8 °C/W
W) ( 1.6 MAXIMUM POWER DISSIPATION TION PA 8-LEAD MSOP
The maximum safe power dissipation for the ADA4805-2-EP is
1.2 ISSI D
limited by the associated rise in junction temperature (TJ) on
ER
the die. At approximately 150°C, which is the glass transition
W 0.8
temperature, the properties of the plastic change. Even temporarily
M PO
exceeding this temperature limit may change the stresses that the
MU XI 0.4
package exerts on the die, permanently shifting the parametric
MA
performance of the ADA4805-2-EP. Exceeding a junction tempera- ture of 175°C for an extended period of time can result in changes
0
1 1 0
–55 –35 –15 5 25 45 65 85 105 125
in silicon devices, potential y causing degradation or loss of
AMBIENT TEMPERATURE (°C)
13741- functionality. Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board The power dissipated in the package (PD) is the sum of the
ESD CAUTION
quiescent power dissipation and the power dissipated in the die due to the ADA4805-2-EP output load drive. Rev. 0 | Page 6 of 9 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL APPLICATIONS CIRCUIT TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ±5 V SUPPLY 5 V SUPPLY 3 V SUPPLY ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE MAXIMUM POWER DISSIPATION ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE