Datasheet AD8315 (Analog Devices) - 9

AD8315 Data Sheet 4 4 –30°C +85°C 3 3 2 2 1 1 B) B) d d R ( 0 R ( 0 RRO RRO E –1 E –1 +85°C –30°C –2 –2 ERROR AT +85°C AND –30°C –3 BASED ON DEVIATION FROM –3 ERROR AT +85°C AND –30°C SLOPE AND INTERCEPT AT +25°C BASED ON DEVIATION FROM SLOPE AND INTERCEPT AT +25°C –4 –4 –80 –70 –60 –50 –40 –30 –20 –10 0 –80 –70 –60 –50 –40 –30 –20 –10 0 RF INPUT AMPLITUDE (dBV)
009
RF INPUT AMPLITUDE (dBV)
12 0 0- 0-
(–47dBm) (+3dBm)
152
(–47dBm) (+3dBm)
52 0 01 Figure 10. Distribution of Error at Temperature After Ambient Normalization vs. Figure 13. Distribution of Error at Temperature After Ambient Normalization vs. Input Amplitude, 3 Sigma to Either Side of Mean, 0.1 GHz Input Amplitude, 3 Sigma to Either Side of Mean, 1.9 GHz
4 4 3 3 –30°C 2 2 1 1 B) d B) d R ( 0 R ( O 0 RRO RR E –1 E –1 +85°C –2 –30°C –2 –3 ERROR AT +85°C AND –30°C –3 +85°C ERROR AT +85°C AND –30°C BASED ON DEVIATION FROM BASED ON DEVIATION FROM SLOPE AND INTERCEPT AT +25°C SLOPE AND INTERCEPT AT +25°C –4 –4 –80 –70 –60 –50 –40 –30 –20 –10 0 –80 –70 –60 –50 –40 –30 –20 –10 0
0
RF INPUT AMPLITUDE (dBV)
01
RF INPUT AMPLITUDE (dBV)
013 20- 0-
(–47dBm) (+3dBm)
15
(–47dBm) (+3dBm)
0 152 0 Figure 11. Distribution of Error at Temperature After Ambient Normalization vs. Figure 14. Distribution of Error at Temperature After Ambient Normalization vs. Input Amplitude, 3 Sigma to Either Side of Mean, 0.9 GHz Input Amplitude, 3 Sigma to Either Side of Mean, 2.5 GHz
3000 0 10 2700 –200 2400 –400 8 FREQUENCY MSOP CHIP SCALE (LFCSP) 2100 (GHz) R – jXΩ R – jXΩ –600 A) ) 0.1 2900 – j1900 2700 – j1500 ) Ω (m 0.9 700 – j240 730 – j220 Ω 1800 ( 6 E ( –800 1.9 130 – j80 460 – j130 NT C X (LFCSP) CE N 2.5 170 – j70 440 – j110 RE A 1500 –1000 TAN ST C CUR 1200 A Y 4 ESI –1200 R X L R RE P DECREASING INCREASING 900 –1400 UP X (MSOP) S V V ENBL ENBL 600 R (LFCSP) –1600 2 300 –1800 R (MSOP) 0 –2000 0 0 0.5 1.0 1.5 2.0 2.5 1.3 1.4 1.5 1.6 1.7
14 -011 0 0-
FREQUENCY (GHz)
520
V
52 1
ENBL (V)
0 01 Figure 12. Input Impedance Figure 15. Supply Current vs. VENBL Rev. D | Page 8 of 22 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION BASIC THEORY CONTROLLER-MODE LOG AMPS CONTROL LOOP DYNAMICS Example PRACTICAL LOOP A NOTE ABOUT POWER EQUIVALENCY BASIC CONNECTIONS RANGE ON VSET AND RFIN TRANSIENT RESPONSE MOBILE HANDSET POWER CONTROL EXAMPLE ENABLE AND POWER-ON INPUT COUPLING OPTIONS USING THE CHIP SCALE PACKAGE EVALUATION BOARD OUTLINE DIMENSIONS ORDERING GUIDE