Datasheet AD524 (Analog Devices) - 9

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AD524 ABSOLUTE MAXIMUM RATINGS CONNECTION DIAGRAMS Table 3. Parameter Rating – INPUT 1 16 RG1
Supply Voltage ±18 V
+ INPUT 2 15 OUTPUT NULL
Internal Power Dissipation 450 mW
RG2 3 14 OUTPUT NULL AD524
Input Voltage1
INPUT NULL 4 13 G = 10 SHORT TO TOP VIEW RG2 FOR
(Either Input Simultaneously) |V
INPUT NULL 5 12 G = 100
IN| + |VS| <36 V
(Not to Scale) DESIRED
Output Short-Circuit Duration Indefinite
REFERENCE 6 11 G = 1000 GAIN –V
Storage Temperature Range
S 7 10 SENSE +V
(R) –65°C to +125°C
S 8 9 OUTPUT
(D, E) –65°C to +150°C
4 15
Operating Temperature Range
+V –V S S INPUT 5 14
003 AD524A/AD524B/AD524C –25°C to +85°C
OUTPUT OFFSET NULL OFFSET NULL
500- 0 0 AD524S –55°C to +125°C Figure 3. Ceramic (D) and Lead Temperature (Soldering, 60 sec) +300°C SOIC (RW-16 and D-16) Packages 1 Maximum input voltage specification refers to maximum voltage to which either input terminal may be raised with or without device power applied.
T T
For example, with ±18 volt supplies maximum, V
UT U
IN is ±18 V; with zero supply
PU L P 1 T
voltage maximum, V
N
IN is ±36 V.
INP + –I NC RG OU NUL
Stresses above those listed under Absolute Maximum Ratings
3 2 1 20 19
may cause permanent damage to the device. This is a stress
RG 4 2 18 OUTPUT NULL
rating only; functional operation of the device at these or any
INPUT NULL 5 17 G = 10 AD524 SHORT TO
other conditions above those indicated in the operational
NC 6 16 NC RG2 FOR TOP VIEW INPUT NULL 7 (Not to Scale) 15 G = 100 DESIRED
section of this specification is not implied. Exposure to absolute
GAIN REFERENCE 8 14 G = 1000
maximum rating conditions for extended periods may affect device reliability.
9 10 11 12 13 NC = NO CONNECT S S T E NC U S OUTPUT SENSE –V +V G = 10 NULL G = 100 G = 1000 TP 10 13 SEN 14 12 11 OU OUTPUT 7 19 NULL 9 15 OUTPUT +VS –VS INPUT 5 18 OUTPUT
004
RG 8 +V OFFSET NULL OFFSET NULL 1 16 S
0500- 0 Figure 4. Leadless Chip Carrier (E)
0.103 –INPUT (2.61) 1 +INPUT2 7 –V ESD CAUTION S RG23 4 5 6 INPUT INPUT REFERENCE NULL NULL 0.170 (4.33)
02
PAD NUMBERS CORRESPOND TO PIN NUMBERS FOR
0 0-
THE D-16 AND RW-16 16-LEAD CERAMIC PACKAGES.
50 00 Figure 2. Metallization Photograph Contact factory for latest dimensions; Dimensions shown in inches and (mm) Rev. F | Page 8 of 28 Document Outline FEATURES FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS CONNECTION DIAGRAMS ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS THEORY OF OPERATION INPUT PROTECTION INPUT OFFSET AND OUTPUT OFFSET GAIN INPUT BIAS CURRENTS COMMON-MODE REJECTION GROUNDING SENSE TERMINAL REFERENCE TERMINAL PROGRAMMABLE GAIN AUTOZERO CIRCUITS ERROR BUDGET ANALYSIS OUTLINE DIMENSIONS ORDERING GUIDE