Datasheet AD8229-KGD (Analog Devices) - 8
| Fabricante | Analog Devices |
| Descripción | 1 nV/√Hz Low Noise 210°C Instrumentation Amplifier |
| Páginas / Página | 8 / 8 — AD8229-KGD. Known Good Die. OUTLINE DIMENSIONS. 0.493 0.483 0.473. 1.755. … |
| Formato / tamaño de archivo | PDF / 148 Kb |
| Idioma del documento | Inglés |
AD8229-KGD. Known Good Die. OUTLINE DIMENSIONS. 0.493 0.483 0.473. 1.755. 2.890. 5 6. TOP VIEW. SIDE VIEW. 1- 1. (CIRCUIT SIDE)
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AD8229-KGD Known Good Die OUTLINE DIMENSIONS 0.493 0.483 0.473 1.755 10 1 2 3 9 2.890 4 5 6 8 7 A TOP VIEW SIDE VIEW 1- 1 (CIRCUIT SIDE) 20 0.092 × 0.092 16- 08-
Figure 4. AD8229-KGD Die 1.755 mm × 2.890 mm Die Size (Dimensions shown in millimeters)
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 4. Die Specifications Parameter Value Unit1
Chip Size 1665 × 2800 μm Scribe Line Width 90 × 90 μm Die Size 1.755 × 2.890 mm (maximum) Thickness 483 ± 10 μm Bond Pad 92 × 92 μm (minimum) Bond Pad Composition 0.5 AlCu % Backside Bare N/A Passivation Polymide N/A 1 N/A means not applicable.
Table 5. Assembly Recommendations Assembly Component Recommendation
Die Attach No special requirements Bonding Method Gold ball or aluminum wedge Bonding Sequence Any
ORDERING GUIDE Model Temperature Range Package Option
AD8229-KGD-CHIPS −40°C to +210°C Die Only
©2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10107-0-8/11(0)
Rev. 0 | Page 8 of 8 Document Outline Features Applications General Description Functional Block Diagram Revision History Specifications Absolute Maximum Ratings ESD Caution Pad Configuration and Function Descriptions Outline Dimensions Die Specifications and Assembly Recommendations Ordering Guide
AD8229-KGD Known Good Die OUTLINE DIMENSIONS 0.493 0.483 0.473 1.755 10 1 2 3 9 2.890 4 5 6 8 7 A TOP VIEW SIDE VIEW 1- 1 (CIRCUIT SIDE) 20 0.092 × 0.092 16- 08-
Figure 4. AD8229-KGD Die 1.755 mm × 2.890 mm Die Size (Dimensions shown in millimeters)
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 4. Die Specifications Parameter Value Unit1
Chip Size 1665 × 2800 μm Scribe Line Width 90 × 90 μm Die Size 1.755 × 2.890 mm (maximum) Thickness 483 ± 10 μm Bond Pad 92 × 92 μm (minimum) Bond Pad Composition 0.5 AlCu % Backside Bare N/A Passivation Polymide N/A 1 N/A means not applicable.
Table 5. Assembly Recommendations Assembly Component Recommendation
Die Attach No special requirements Bonding Method Gold ball or aluminum wedge Bonding Sequence Any
ORDERING GUIDE Model Temperature Range Package Option
AD8229-KGD-CHIPS −40°C to +210°C Die Only
©2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10107-0-8/11(0)
Rev. 0 | Page 8 of 8 Document Outline Features Applications General Description Functional Block Diagram Revision History Specifications Absolute Maximum Ratings ESD Caution Pad Configuration and Function Descriptions Outline Dimensions Die Specifications and Assembly Recommendations Ordering Guide