Datasheet AD8132 (Analog Devices) - 10

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AD8132 ABSOLUTE MAXIMUM RATINGS Table 7.
The power dissipated in the package (PD) is the sum of the
Parameter Rating
quiescent power dissipation and the power dissipated in the Supply Voltage ±5.5 V package due to the load drive for all outputs. The quiescent VOCM ±VS power is the voltage between the supply pins (VS) times the Internal Power Dissipation 250 mW quiescent current (IS). The load current consists of the differential Operating Temperature Range −40°C to +125°C and common-mode currents flowing to the load, as well as Storage Temperature Range −65°C to +150°C currents flowing through the external feedback networks and Lead Temperature (Soldering 10 sec) 300°C the internal common-mode feedback loop. The internal resistor Junction Temperature 150°C tap used in the common-mode feedback loop places a 1 kΩ differential load on the output. Consider rms voltages and Stresses above those listed under Absolute Maximum Ratings currents when dealing with ac signals. may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any Airflow reduces θJA. In addition, more metal directly in contact other conditions above those indicated in the operational with the package leads from metal traces through holes, ground, section of this specification is not implied. Exposure to absolute and power planes reduces the θJA. maximum rating conditions for extended periods may affect device reliability. Figure 3 shows the maximum safe power dissipation in the package vs. the ambient temperature for the 8-lead SOIC
THERMAL RESISTANCE
(θJA = 121°C/W) and 8-lead MSOP (θJA = 142°C/W) packages θJA is specified for the worst-case conditions, that is, θJA is on a JEDEC standard 4-layer board. θJA values are approximations. specified for the device soldered in a circuit board in still air.
1.75 Table 8. ) 1.50 Package Type θJA Unit W (
8-Lead SOIC, 4-Layer 121 °C/W
ION T 1.25
8-Lead MSOP, 4-Layer 142 °C/W
A IP ISS 1.00 D SOIC MAXIMUM POWER DISSIPATION R E W 0.75 O
The maximum safe power dissipation in the AD8132 packages
MSOP M P
is limited by the associated rise in junction temperature (TJ) on
0.50 IMU
the die. At approximately 150°C, the glass transition temperature,
X MA 0.25
the plastic changes its properties. Even temporarily exceeding this temperature limit can change the stresses that the package
0
82
–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 100 110 120
0 5- exerts on the die, permanently shifting the parametric performance
AMBIENT TEMPERATURE (°C)
03 01 of the AD8132. Exceeding a junction temperature of 150°C for Figure 3. Maximum Power Dissipation vs. Ambient Temperature an extended period can result in changes in the silicon devices, potentially causing failure.
ESD CAUTION
Rev. I | Page 9 of 32 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION CONNECTION DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ±DIN TO ±OUT SPECIFICATIONS VOCM TO ±OUT SPECIFICATIONS ±DIN TO ±OUT SPECIFICATIONS VOCM TO ±OUT SPECIFICATIONS ±DIN TO ±OUT SPECIFICATIONS VOCM TO ±OUT SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE MAXIMUM POWER DISSIPATION ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS OPERATIONAL DESCRIPTION DEFINITION OF TERMS Differential Voltage Common-Mode Voltage BASIC CIRCUIT OPERATION THEORY OF OPERATION GENERAL USAGE OF THE AD8132 DIFFERENTIAL AMPLIFIER WITHOUT RESISTORS (HIGH INPUT IMPEDANCE INVERTING AMPLIFIER) OTHER β2 = 1 CIRCUITS VARYING β2 β1 = 0 ESTIMATING THE OUTPUT NOISE VOLTAGE CALCULATING INPUT IMPEDANCE OF THE APPLICATION CIRCUIT INPUT COMMON-MODE VOLTAGE RANGE IN SINGLE-SUPPLY APPLICATIONS SETTING THE OUTPUT COMMON-MODE VOLTAGE DRIVING A CAPACITIVE LOAD OPEN-LOOP GAIN AND PHASE LAYOUT, GROUNDING, AND BYPASSING CIRCUITS APPLICATIONS INFORMATION ANALOG-TO-DIGITAL DRIVER BALANCED CABLE DRIVER TRANSMIT EQUALIZER LOW-PASS DIFFERENTIAL FILTER HIGH COMMON-MODE OUTPUT IMPEDANCE AMPLIFIER FULL-WAVE RECTIFIER AUTOMOTIVE PRODUCTS OUTLINE DIMENSIONS ORDERING GUIDE