Datasheet ADA4937-1/ADA4937-2 (Analog Devices) - 7

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Data Sheet ADA4937-1/ADA4937-2 ABSOLUTE MAXIMUM RATINGS Table 5.
The power dissipated in the package (PD) is the sum of the
Parameter Rating
quiescent power dissipation and the power dissipated in the package due to the load drive. The quiescent power is the voltage Supply Voltage 5.5 V between the supply pins (V Power Dissipation See Figure 4 S) times the quiescent current (IS). The power dissipated due to the load drive depends upon the Storage Temperature Range −65°C to +125°C particular application. The power due to load drive is calculated Operating Temperature Range −40°C to +105°C by multiplying the load current by the associated voltage drop Lead Temperature (Soldering, 10 sec) 300°C across the device. RMS voltages and currents must be used in Junction Temperature 150°C these calculations. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a Airflow increases heat dissipation, effectively reducing θJA. In stress rating only; functional operation of the product at these addition, more metal directly in contact with the package or any other conditions above those indicated in the operational leads/exposed pad from metal traces, through holes, ground, section of this specification is not implied. Operation beyond and power planes reduces θJA. the maximum operating conditions for extended periods may Figure 4 shows the maximum safe power dissipation in the affect product reliability. package vs. the ambient temperature for the ADA4937-1 single
THERMAL RESISTANCE
16-lead LFCSP (95°C/W), and the ADA4937-2 dual 24-lead LFCSP (67°C/W) on a JEDEC standard 4-layer board. θJA is specified for the device (including exposed pad) soldered
3.5
to a high thermal conductivity 2s2p circuit board, as described in EIA/JESD51-7.
) 3.0 (W N Table 6. Thermal Resistance IO T 2.5 Package Type θ PA JA θJC Unit ADA4937-2 2.0
16-Lead LFCSP (Exposed Pad) 95 12.6 °C/W
ISSI D
24-Lead LFCSP (Exposed Pad) 67 8.78 °C/W
ER W 1.5 ADA4937-1 Maximum Power Dissipation M PO 1.0 MU XI
The maximum safe power dissipation in the ADA4937-1/
MA 0.5
ADA4937-2 packages is limited by the associated rise in junction temperature (TJ) on the die. At approximately 150°C, which is
0
004 the glass transition temperature, the plastic changes the properties.
–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 100 110 AMBIENT TEMPERATURE (°C)
Even temporarily exceeding this temperature limit can change 06591- Figure 4. Maximum Power Dissipation vs. Temperature, 4-Layer Board the stresses that the package exerts on the die, permanently shifting the parametric performance of the ADA4937-1/
ESD CAUTION
ADA4937-2. Exceeding a junction temperature of 150°C for an extended period can result in changes in the silicon devices, potentially causing failure. Rev. F | Page 7 of 28 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAMS REVISION HISTORY SPECIFICATIONS 5 V OPERATION ±DIN to ±OUT Performance VOCM to ±OUT Performance 3.3 V OPERATION ±DIN to ±OUT Performance VOCM to ±OUT Performance ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Maximum Power Dissipation ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS TERMINOLOGY THEORY OF OPERATION ANALYZING AN APPLICATION CIRCUIT SETTING THE CLOSED-LOOP GAIN ESTIMATING THE OUTPUT NOISE VOLTAGE IMPACT OF MISMATCHES IN THE FEEDBACK NETWORKS CALCULATING THE INPUT IMPEDANCE FOR AN APPLICATION CIRCUIT Terminating a Single-Ended Input INPUT COMMON-MODE VOLTAGE RANGE IN SINGLE-SUPPLY APPLICATIONS SETTING THE OUTPUT COMMON-MODE VOLTAGE POWER-DOWN OPERATION LAYOUT, GROUNDING, AND BYPASSING HIGH PERFORMANCE ADC DRIVING 3.3 V OPERATION OUTLINE DIMENSIONS ORDERING GUIDE