Datasheet ADA4930-1 (Analog Devices) - 3

1.5 Thermal characteristics. Thermal resistance, junction to ambient (θJA) .. 81.6°C/W 2. APPLICABLE DOCUMENTS JEDEC Solid State Technology Association JEDEC PUB 95 – Registered and Standard Outlines for Semiconductor Devices (Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834 or online at http://www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturer’s part number as shown in 6.3 herein and as follows: A. Manufacturer’s name, CAGE code, or logo B. Pin 1 identifier and H2X C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturer’s part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2.
DLA LAND AND MARITIME
SIZE CODE IDENT NO. DWG NO.
COLUMBUS, OHIO A 16236 V62/13615
REV PAGE 3 Document Outline DESCRIPTION REV REV PMIC N/A DLA LAND AND MARITIME TITLE SIZE A V62/13615 REV