AD1674TIMING—STAND-ALONE MODE (Figures 4a and 4b)J, K, A, B GradesT GradeParameterSymbolMinTypMaxMinTypMaxUnits Data Access Time tDDR 150 150 ns Low R/C Pulse Width tHRL 50 50 ns STS Delay from R/C tDS 200 225 ns Data Valid After R/C Low tHDR 25 25 ns STS Delay After Data Valid tHS 0.6 0.8 1.2 0.6 0.8 1.2 µs High R/C Pulse Width tHRH 150 150 ns NOTE All min and max specifications are guaranteed. Specifications subject to change without notice. tHRL__R/CR/CttHRHDStDSSTSSTStCtttDDRHDRCttHDRHSHIGH-ZDATAHIGH-ZDB11 – DB0HIGH-ZVALIDDATADB11 – DB0DATA VALIDVALIDtHL Figure 4a. Stand-Alone Mode Timing Low Pulse for R/C Figure 4b. Stand-Alone Mode Timing High Pulse for R/C ABSOLUTE MAXIMUM RATINGS* . Momentary Short to VCC V Junction Temperature . +175°C CC to Digital Common . 0 to + 16.5 V V Power Dissipation . 825 mW EE to Digital Common . 0 to –16.5 V V Lead Temperature, Soldering (10 sec) . +300°C, 10 sec LOGIC to Digital Common . 0 V to +7 V Analog Common to Digital Common . ± 1 V Storage Temperature . –65°C to +150°C Digital Inputs to Digital Common . –0.5 V to VLOGIC +0.5 V *Stresses above those listed under “Absolute Maximum Ratings” may cause Analog Inputs to Analog Common . V permanent damage to the device. This is a stress rating only and functional EE to VCC 20 V operation of the device at these or any other conditions above those indicated in the IN to Analog Common . VEE to +24 V operational section of this specification is not implied. Exposure to absolute REF OUT . Indefinite Short to Common maximum rating conditions for extended periods may affect device reliability. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although WARNING! the AD1674 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are ESD SENSITIVE DEVICE recommended to avoid performance degradation or loss of functionality. ORDERING GUIDEINLS/(N+D)PackagePackageModel1Temperature Range(TMIN to TMAX)(TMIN to TMAX)DescriptionOption2 AD1674JN 0°C to +70°C ±1 LSB 69 dB Plastic DIP N-28 AD1674KN 0°C to +70°C ±1/2 LSB 70 dB Plastic DIP N-28 AD1674JR 0°C to +70°C ±1 LSB 69 dB Plastic SOIC R-28 AD1674KR 0°C to +70°C ±1/2 LSB 70 dB Plastic SOIC R-28 AD1674AR –40°C to +85°C ±1 LSB 69 dB Plastic SOIC R-28 AD1674BR –40°C to +85°C ±1/2 LSB 70 dB Plastic SOIC R-28 AD1674AD –40°C to +85°C ±1 LSB 69 dB Ceramic DIP D-28 AD1674BD –40°C to +85°C ±1/2 LSB 70 dB Ceramic DIP D-28 AD1674TD –55°C to +125°C ±1 LSB 70 dB Ceramic DIP D-28 NOTES 1For details on grade and package offerings screened in accordance with MIL-STD-883, refer to the Analog Devices Military Products Databook or current AD1674/883B data sheet. SMD is also available. 2N = Plastic DIP; D = Hermetic Ceramic DIP; R = Plastic SOIC. –6– REV. C