Datasheet AD7853, AD7853L (Analog Devices) - 6

AD7853/AD7853L ABSOLUTE MAXIMUM RATINGS1 ORDERING GUIDE
(TA = +25°C unless otherwise noted) AV
Linearity Power
DD to AGND . –0.3 V to +7 V DV
Error Dissipation Package
DD to DGND . –0.3 V to +7 V AV
Model (LSB)1 (mW) Options2
DD to DVDD . –0.3 V to +0.3 V Analog Input Voltage to AGND . –0.3 V to AVDD + 0.3 V AD7853AN ±1 20 N-24 Digital Input Voltage to DGND . –0.3 V to DVDD + 0.3 V AD7853BN ±1/2 20 N-24 Digital Output Voltage to DGND . –0.3 V to DVDD + 0.3 V AD7853LAN3 ±1 6.85 N-24 REFIN/REFOUT to AGND . –0.3 V to AVDD + 0.3 V AD7853LBN3 ±1 6.85 N-24 Input Current to Any Pin Except Supplies2 . ± 10 mA AD7853AR ±1 20 R-24 Operating Temperature Range AD7853BR ±1/2 20 R-24 Commercial (A, B Versions) . –40°C to +85°C AD7853LAR3 ±1 6.85 R-24 Storage Temperature Range . –65°C to +150°C AD7853LBR3 ±1 6.85 R-24 Junction Temperature . +150°C AD7853ARS ±1 6.85 RS-24 Plastic DIP Package, Power Dissipation . 450 mW AD7853LARS3 ±1 6.85 RS-24 θJA Thermal Impedance . 105°C/W EVAL-AD7853CB4 θJC Thermal Impedance . 34.7°C/W EVAL-CONTROL BOARD5 Lead Temperature, (Soldering, 10 sec) . +260°C NOTES SOIC, SSOP Package, Power Dissipation . 450 mW 1 θ Linearity error refers to the integral linearity error. JA Thermal Impedance . 75°C/W (SOIC) 115°C/W (SSOP) 2N = Plastic DIP; R = SOIC; RS = SSOP. θ 3 JC Thermal Impedance . 25°C/W (SOIC) 35°C/W (SSOP) L signifies the low power version. Lead Temperature, Soldering 4This can be used as a stand-alone evaluation board or in conjunction with the Vapor Phase (60 sec) . +215°C EVAL-CONTROL BOARD for evaluation/demonstration purposes. 5This board is a complete unit allowing a PC to control and communicate with Infrared (15 sec) . +220°C all Analog Devices, Inc. evaluation boards ending in the CB designators. ESD . >3 kV NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma-
PIN CONFIGURATIONS
nent damage to the device. This is a stress rating only; functional operation of the
DIP, SOIC AND SSOP
device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
CONVST 1 24 SYNC
2Transient currents of up to 100 mA will not cause SCR latch-up.
BUSY 2 23 SCLK SLEEP 3 22 CLKIN REF 4 21 I N /REFOUT DIN AV 5 20 DD AD7853/53L DOUT TOP VIEW AGND 6 19 DGND (Not to Scale) CREF1 7 18 DVDD CREF2 8 17 CAL AIN(+) 9 16 SM2 AIN(–) 10 15 SM1 NC 11 14 POLARITY AGND 12 13 AMODE NC = NO CONNECT
–6– REV. B