Datasheet AD7822, AD7825, AD7829 (Analog Devices) - 6
| Fabricante | Analog Devices |
| Descripción | 3 V/5 V, 2 MSPS, 8-Bit, 1-/4-/8-Channel Sampling ADCs |
| Páginas / Página | 28 / 6 — AD7822/AD7825/AD7829. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter … |
| Revisión | C |
| Formato / tamaño de archivo | PDF / 531 Kb |
| Idioma del documento | Inglés |
AD7822/AD7825/AD7829. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter Rating. ESD CAUTION
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AD7822/AD7825/AD7829 ABSOLUTE MAXIMUM RATINGS
T A = 25°C, unless otherwise noted.
Table 3.
Stresses above those listed under Absolute Maximum Ratings
Parameter Rating
may cause permanent damage to the device. This is a stress VDD to AGND −0.3 V to +7 V rating only; functional operation of the device at these or any VDD to DGND −0.3 V to +7 V other conditions above those indicated in the operational Analog Input Voltage to AGND section of this specification is not implied. Exposure to absolute VIN1 to VIN8 −0.3 V to VDD + 0.3 V maximum rating conditions for extended periods may affect Reference Input Voltage to AGND −0.3 V to VDD + 0.3 V device reliability. VMID Input Voltage to AGND −0.3 V to VDD + 0.3 V Digital Input Voltage to DGND −0.3 V to VDD + 0.3 V Digital Output Voltage to DGND −0.3 V to VDD + 0.3 V Operating Temperature Range Industrial (B Version) −40°C to +85°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C PDIP Package, Power Dissipation 450 mW θJA Thermal Impedance 105°C/W Lead Temperature, (Soldering, 10 sec) 260°C SOIC Package, Power Dissipation 450 mW θJA Thermal Impedance 75°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C TSSOP Package, Power Dissipation 450 mW θJA Thermal Impedance 128°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C ESD 1 kV
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. C | Page 6 of 28 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING CHARACTERISTICS TIMING DIAGRAM ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TERMINOLOGY CIRCUIT INFORMATION CIRCUIT DESCRIPTION TYPICAL CONNECTION DIAGRAM ADC TRANSFER FUNCTION ANALOG INPUT POWER-UP TIMES POWER VS. THROUGHPUT OPERATING MODES PARALLEL INTERFACE MICROPROCESSOR INTERFACING AD7822/AD7825/AD7829 TO 8051 AD7822/AD7825/AD7829 TO PIC16C6x/PIC16C7x AD7822/AD7825/AD7829 TO ADSP-21xx INTERFACING MULTIPLEXER ADDRESS INPUTS AD7822 STANDALONE OPERATION OUTLINE DIMENSIONS ORDERING GUIDE
T A = 25°C, unless otherwise noted.
Table 3.
Stresses above those listed under Absolute Maximum Ratings
Parameter Rating
may cause permanent damage to the device. This is a stress VDD to AGND −0.3 V to +7 V rating only; functional operation of the device at these or any VDD to DGND −0.3 V to +7 V other conditions above those indicated in the operational Analog Input Voltage to AGND section of this specification is not implied. Exposure to absolute VIN1 to VIN8 −0.3 V to VDD + 0.3 V maximum rating conditions for extended periods may affect Reference Input Voltage to AGND −0.3 V to VDD + 0.3 V device reliability. VMID Input Voltage to AGND −0.3 V to VDD + 0.3 V Digital Input Voltage to DGND −0.3 V to VDD + 0.3 V Digital Output Voltage to DGND −0.3 V to VDD + 0.3 V Operating Temperature Range Industrial (B Version) −40°C to +85°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C PDIP Package, Power Dissipation 450 mW θJA Thermal Impedance 105°C/W Lead Temperature, (Soldering, 10 sec) 260°C SOIC Package, Power Dissipation 450 mW θJA Thermal Impedance 75°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C TSSOP Package, Power Dissipation 450 mW θJA Thermal Impedance 128°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C ESD 1 kV
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. C | Page 6 of 28 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING CHARACTERISTICS TIMING DIAGRAM ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TERMINOLOGY CIRCUIT INFORMATION CIRCUIT DESCRIPTION TYPICAL CONNECTION DIAGRAM ADC TRANSFER FUNCTION ANALOG INPUT POWER-UP TIMES POWER VS. THROUGHPUT OPERATING MODES PARALLEL INTERFACE MICROPROCESSOR INTERFACING AD7822/AD7825/AD7829 TO 8051 AD7822/AD7825/AD7829 TO PIC16C6x/PIC16C7x AD7822/AD7825/AD7829 TO ADSP-21xx INTERFACING MULTIPLEXER ADDRESS INPUTS AD7822 STANDALONE OPERATION OUTLINE DIMENSIONS ORDERING GUIDE