link to page 24 link to page 25 link to page 26 link to page 26 Data SheetAD7938-6TIMING SPECIFICATIONS VDD = VDRIVE = 2.7 V to 5.25 V, internal/external VREF = 2.5 V, unless otherwise noted; fCLKIN = 10MHz, fSAMPLE = 625 kSPS; TA = TMIN to TMAX, unless otherwise noted. Table 3. Parameter1 Limit at TMIN, TMAX UnitDescription f 2 CLKIN 700 kHz min CLKIN frequency 10 MHz max tQUIET 30 ns min Minimum time between end of read and start of next conversion, that is, time from when the data bus goes into three-state until the next falling edge of CONVST. t1 10 ns min CONVST pulse width. t2 15 ns min CONVST falling edge to CLKIN falling edge setup time. t3 50 ns max CLKIN falling edge to BUSY rising edge. t4 0 ns min CS to WR setup time. t5 0 ns min CS to WR hold time. t6 10 ns min WR pulse width. t7 10 ns min Data setup time before WR. t8 10 ns min Data hold after WR. t9 10 ns min New data valid before falling edge of BUSY. t10 0 ns min CS to RD setup time. t11 0 ns min CS to RD hold time. t12 30 ns min RD pulse width. t 3 13 30 ns max Data access time after RD. t 4 14 3 ns min Bus relinquish time after RD. 50 ns max Bus relinquish time after RD. t15 0 ns min HBEN to RD setup time. t16 0 ns min HBEN to RD hold time. t17 10 ns min Minimum time between reads/writes. t18 0 ns min HBEN to WR setup time. t19 10 ns min HBEN to WR hold time. t20 40 ns max CLKIN falling edge to BUSY falling edge. t21 15.7 ns min CLKIN low pulse width. t22 7.8 ns min CLKIN high pulse width. 1 Sample tested during initial release to ensure compliance. All input signals are specified with tRISE = tFALL = 5 ns (10% to 90% of VDD) and timed from a voltage level of 1.6 V. All timing specifications given above are with a 25 pF load capacitance (see Figure 36, Figure 37, Figure 38, and Figure 39). 2 Minimum CLKIN for specified performance, with slower CLKIN frequencies performance specifications apply typical y. 3 The time required for the output to cross 0.4 V or 2.4 V. 4 t14 is derived from the measured time taken by the data outputs to change 0.5 V. The measured number is then extrapolated back to remove the effects of charging or discharging the 25 pF capacitor. This means that the time, t14, quoted in the timing characteristics is the true bus relinquish time of the part and is independent of the bus loading. Rev. D | Page 5 of 32 Document Outline FEATURES FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION PRODUCT HIGHLIGHTS REVISION HISTORY SPECIFICATIONS TIMING SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TERMINOLOGY ON-CHIP REGISTERS CONTROL REGISTER SEQUENCER OPERATION Writing to the Control Register to Program the Sequencer SHADOW REGISTER CIRCUIT INFORMATION CONVERTER OPERATION ADC TRANSFER FUNCTION TYPICAL CONNECTION DIAGRAM ANALOG INPUT STRUCTURE ANALOG INPUTS Single-Ended Mode Differential Mode Driving Differential Inputs Using an Op Amp Pair Pseudo Differential Mode ANALOG INPUT SELECTION Traditional Multichannel Operation (SEQ = 0, SHDW = 0) Using the Sequencer: Programmable Sequence (SEQ = 0, SHDW = 1 ) Consecutive Sequence (SEQ = 1, SHDW = 1) REFERENCE Digital Inputs VDRIVE Input PARALLEL INTERFACE Reading Data from the AD7938-6 Writing Data to the AD7938-6 POWER MODES OF OPERATION Normal Mode (PM1 = PM0 = 0) Autoshutdown (PM1 = 0; PM0 = 1) Autostandby (PM1 = 1; PM0 = 0) Full Shutdown Mode (PM1 =1; PM0 = 1) POWER vs. THROUGHPUT RATE MICROPROCESSOR INTERFACING AD7938-6 to ADSP-21xx Interface AD7938-6 to ADSP-21065L Interface AD7938-6 to TMS32020, TMS320C25, and TMS320C5x Interface AD7938-6 to 80C186 Interface APPLICATION HINTS GROUNDING AND LAYOUT PCB DESIGN GUIDELINES FOR CHIP SCALE PACKAGE EVALUATING THE AD7938-6 PERFORMANCE OUTLINE DIMENSIONS ORDERING GUIDE