Datasheet AD7175-2 (Analog Devices) - 10
| Fabricante | Analog Devices |
| Descripción | 24-Bit, 250 kSPS, Sigma-Delta ADC with 20 µs Settling and True Rail-to-Rail Buffers |
| Páginas / Página | 63 / 10 — THERMAL RESISTANCE. Table 3. Parameter. Rating. Table 4. Thermal … |
| Revisión | B |
| Formato / tamaño de archivo | PDF / 1.1 Mb |
| Idioma del documento | Inglés |
THERMAL RESISTANCE. Table 3. Parameter. Rating. Table 4. Thermal Resistance. Package Type. θJA. Unit. ESD CAUTION
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Versión de texto del documento
Data Sheet AD7175-2 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE Table 3.
θJA is specified for a device soldered on a JEDEC test board for
Parameter Rating
surface-mount packages. AVDD1, AVDD2 to AVSS −0.3 V to +6.5 V
Table 4. Thermal Resistance
AVDD1 to DGND −0.3 V to +6.5 V
Package Type θJA Unit
IOVDD to DGND −0.3 V to +6.5 V 24-Lead TSSOP IOVDD to AVSS −0.3 V to +7.5 V JEDEC 1-Layer Board 149 °C/W AVSS to DGND −3.25 V to +0.3 V JEDEC 2-Layer Board 81 °C/W Analog Input Voltage to AVSS −0.3 V to AVDD1 + 0.3 V Reference Input Voltage to AVSS −0.3 V to AVDD1 + 0.3 V
ESD CAUTION
Digital Input Voltage to DGND −0.3 V to IOVDD + 0.3 V Digital Output Voltage to DGND −0.3 V to IOVDD + 0.3 V Analog Input/Digital Input Current 10 mA Operating Temperature Range −40°C to +105°C Storage Temperature Range −65°C to +150°C Maximum Junction Temperature 150°C Lead Soldering, Reflow Temperature 260°C ESD Rating (HBM) 4 kV Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 9 of 62
THERMAL RESISTANCE Table 3.
θJA is specified for a device soldered on a JEDEC test board for
Parameter Rating
surface-mount packages. AVDD1, AVDD2 to AVSS −0.3 V to +6.5 V
Table 4. Thermal Resistance
AVDD1 to DGND −0.3 V to +6.5 V
Package Type θJA Unit
IOVDD to DGND −0.3 V to +6.5 V 24-Lead TSSOP IOVDD to AVSS −0.3 V to +7.5 V JEDEC 1-Layer Board 149 °C/W AVSS to DGND −3.25 V to +0.3 V JEDEC 2-Layer Board 81 °C/W Analog Input Voltage to AVSS −0.3 V to AVDD1 + 0.3 V Reference Input Voltage to AVSS −0.3 V to AVDD1 + 0.3 V
ESD CAUTION
Digital Input Voltage to DGND −0.3 V to IOVDD + 0.3 V Digital Output Voltage to DGND −0.3 V to IOVDD + 0.3 V Analog Input/Digital Input Current 10 mA Operating Temperature Range −40°C to +105°C Storage Temperature Range −65°C to +150°C Maximum Junction Temperature 150°C Lead Soldering, Reflow Temperature 260°C ESD Rating (HBM) 4 kV Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 9 of 62