Datasheet LTC3109 (Analog Devices) - 4
| Fabricante | Analog Devices |
| Descripción | Auto-Polarity, Ultralow Voltage Step-Up Converter and Power Manager |
| Páginas / Página | 24 / 4 — elecTrical characTerisTics. Note 5:. Note 6:. Note 3:. Note 4: |
| Formato / tamaño de archivo | PDF / 424 Kb |
| Idioma del documento | Inglés |
elecTrical characTerisTics. Note 5:. Note 6:. Note 3:. Note 4:
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LTC3109
elecTrical characTerisTics
board layout, the rated thermal package thermal resistance and other
Note 5:
Failure to solder the exposed backside of the QFN package to the environmental factors. The junction temperature (TJ) is calculated from PC board ground plane will result in a thermal resistance much higher the ambient temperature (TA) and power dissipation (PD) according to than 37°C/W. the formula: TJ = TA + (PD • θJA°C/W), where θJA is the package thermal
Note 6:
The Absolute Maximum Rating is a DC rating. Under certain impedance. conditions in the applications shown, the peak AC voltage on the C2A and
Note 3:
Specification is guaranteed by design and not 100% tested in C2B pins may exceed ±8V. This behavior is normal and acceptable because production. the current into the pin is limited by the impedance of the coupling
Note 4:
Current measurements are made when the output is not switching. capacitor.
Typical perForMance characTerisTics TA = 25°C, unless otherwise noted. IIN vs VIN IVOUT vs VIN PVOUT vs VIN
1000 10000 100 VOUT = 0V 1:100 RATIO, C1 = 1nF 1:50 RATIO 1:50 RATIO, C1 = 4.7nF C1 = 4.7nF 1:20 RATIO, C1 = 10nF VOUT = 3.3V VOUT = 5V 100 1000 NO LOAD ON VLDO 10 (µA) (mW) (mA) VOUT = 3.3V I IN I VOUT P VOUT 10 100 1 1:100 RATIO, C1 = 1nF 1:50 RATIO, C1 = 4.7nF 1:20 RATIO, C1 = 10nF 1 10 0.1 10 100 1000 10 100 1000 10 100 1000 VIN (mV) VIN (mV) VIN (mV) 3109 G01 3109 G02 3109 G18
Open-Circuit Start-Up Voltage Input Resistance vs VIN Efficiency vs VIN vs Source Resistance
7.0 50 90 VOUT = 0V 1:100 RATIO, C1 = 1nF 6.5 45 1:50 RATIO, C1 = 4.7nF 80 6.0 40 1:20 RATIO, C1 = 10nF 70 VOUT = 0V 5.5 35 60 5.0 30 50 (Ω) 4.5 25 R IN 40 4.0 20 (OPEN CIRCUIT) (mV) EFFICIENCY (%) 3.5 30 15 TUP AR 3.0 20 1:100 RATIO, C1 = 1nF 10 V ST 2.5 1:50 RATIO, C1 = 4.7nF 5 10 1:20 RATIO, C1 = 10nF 2.0 0 0 10 100 1000 10 100 1000 0 1 2 3 4 5 6 7 8 9 10 VIN (mV) VIN (mV) SOURCE RESISTANCE (Ω) 3109 G03 3109 G04 3109 G05 3109fb 4 For more information www.linear.com/LTC3109 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Package Description Typical Application Related Parts
elecTrical characTerisTics
board layout, the rated thermal package thermal resistance and other
Note 5:
Failure to solder the exposed backside of the QFN package to the environmental factors. The junction temperature (TJ) is calculated from PC board ground plane will result in a thermal resistance much higher the ambient temperature (TA) and power dissipation (PD) according to than 37°C/W. the formula: TJ = TA + (PD • θJA°C/W), where θJA is the package thermal
Note 6:
The Absolute Maximum Rating is a DC rating. Under certain impedance. conditions in the applications shown, the peak AC voltage on the C2A and
Note 3:
Specification is guaranteed by design and not 100% tested in C2B pins may exceed ±8V. This behavior is normal and acceptable because production. the current into the pin is limited by the impedance of the coupling
Note 4:
Current measurements are made when the output is not switching. capacitor.
Typical perForMance characTerisTics TA = 25°C, unless otherwise noted. IIN vs VIN IVOUT vs VIN PVOUT vs VIN
1000 10000 100 VOUT = 0V 1:100 RATIO, C1 = 1nF 1:50 RATIO 1:50 RATIO, C1 = 4.7nF C1 = 4.7nF 1:20 RATIO, C1 = 10nF VOUT = 3.3V VOUT = 5V 100 1000 NO LOAD ON VLDO 10 (µA) (mW) (mA) VOUT = 3.3V I IN I VOUT P VOUT 10 100 1 1:100 RATIO, C1 = 1nF 1:50 RATIO, C1 = 4.7nF 1:20 RATIO, C1 = 10nF 1 10 0.1 10 100 1000 10 100 1000 10 100 1000 VIN (mV) VIN (mV) VIN (mV) 3109 G01 3109 G02 3109 G18
Open-Circuit Start-Up Voltage Input Resistance vs VIN Efficiency vs VIN vs Source Resistance
7.0 50 90 VOUT = 0V 1:100 RATIO, C1 = 1nF 6.5 45 1:50 RATIO, C1 = 4.7nF 80 6.0 40 1:20 RATIO, C1 = 10nF 70 VOUT = 0V 5.5 35 60 5.0 30 50 (Ω) 4.5 25 R IN 40 4.0 20 (OPEN CIRCUIT) (mV) EFFICIENCY (%) 3.5 30 15 TUP AR 3.0 20 1:100 RATIO, C1 = 1nF 10 V ST 2.5 1:50 RATIO, C1 = 4.7nF 5 10 1:20 RATIO, C1 = 10nF 2.0 0 0 10 100 1000 10 100 1000 0 1 2 3 4 5 6 7 8 9 10 VIN (mV) VIN (mV) SOURCE RESISTANCE (Ω) 3109 G03 3109 G04 3109 G05 3109fb 4 For more information www.linear.com/LTC3109 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Package Description Typical Application Related Parts