Datasheet LTC3834 (Analog Devices) - 28
| Fabricante | Analog Devices |
| Descripción | 30μA IQ Synchronous Step-Down Controller |
| Páginas / Página | 30 / 28 — PACKAGE DESCRIPTION. FE Package. 20-Lead Plastic TSSOP (4.4mm). Exposed … |
| Formato / tamaño de archivo | PDF / 793 Kb |
| Idioma del documento | Inglés |
PACKAGE DESCRIPTION. FE Package. 20-Lead Plastic TSSOP (4.4mm). Exposed Pad Variation CB. UFD Package. 20-Lead Plastic QFN (4mm
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LTC3834
PACKAGE DESCRIPTION FE Package 20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation CB
6.40 – 6.60* 3.86 (.252 – .260) (.152) 3.86 (.152) 20 1918 17 16 15 14 1312 11 6.60 ± 0.10 2.74 (.108) 4.50 ± 0.10 6.40 2.74 SEE NOTE 4 (.252) (.108) 0.45 ± 0.05 BSC 1.05 ±0.10 0.65 BSC RECOMMENDED SOLDER PAD LAYOUT 1 2 3 4 5 6 7 8 9 10 1.20 4.30 – 4.50* (.047) 0.25 (.169 – .177) MAX REF 0° – 8° 0.65 0.09 – 0.20 0.50 – 0.75 (.0256) 0.05 – 0.15 (.0035 – .0079) (.020 – .030) BSC (.002 – .006) 0.195 – 0.30 FE20 (CB) TSSOP 0204 (.0077 – .0118) TYP NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS 4. RECOMMENDED MINIMUM PCB METAL SIZE MILLIMETERS FOR EXPOSED PAD ATTACHMENT 2. DIMENSIONS ARE IN (INCHES) *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.150mm (.006") PER SIDE 3. DRAWING NOT TO SCALE
UFD Package 20-Lead Plastic QFN (4mm
×
5mm)
(Reference LTC DWG # 05-08-1711 Rev B) PIN 1 NOTCH R = 0.20 OR 4.00 ± 0.10 0.75 ± 0.05 R = 0.05 TYP 1.50 REF C = 0.35 (2 SIDES) 19 20 0.70 ± 0.05 0.40 ± 0.10 PIN 1 TOP MARK (NOTE 6) 1 2.65 ± 0.05 2 4.50 ± 0.05 1.50 REF 3.10 ± 0.05 5.00 ± 0.10 3.65 ± 0.05 2.50 REF (2 SIDES) 3.65 ± 0.10 PACKAGE OUTLINE 2.65 ± 0.10 0.25 ± 0.05 0.50 BSC (UFD20) QFN 0506 REV B 2.50 REF 0.200 REF R = 0.115 0.25 ± 0.05 4.10 ± 0.05 TYP 0.00 – 0.05 0.50 BSC 5.50 ± 0.05 BOTTOM VIEW—EXPOSED PAD RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED NOTE: 1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X). 5. EXPOSED PAD SHALL BE SOLDER PLATED 2. DRAWING NOT TO SCALE 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION 3. ALL DIMENSIONS ARE IN MILLIMETERS ON THE TOP AND BOTTOM OF PACKAGE 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 3834fc 28 For more information www.linear.com/LTC3834 Document Outline Features Description Applications Typical Application Absolute Maximum Ratings Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Operation Package Description Typical Application Related Parts
PACKAGE DESCRIPTION FE Package 20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation CB
6.40 – 6.60* 3.86 (.252 – .260) (.152) 3.86 (.152) 20 1918 17 16 15 14 1312 11 6.60 ± 0.10 2.74 (.108) 4.50 ± 0.10 6.40 2.74 SEE NOTE 4 (.252) (.108) 0.45 ± 0.05 BSC 1.05 ±0.10 0.65 BSC RECOMMENDED SOLDER PAD LAYOUT 1 2 3 4 5 6 7 8 9 10 1.20 4.30 – 4.50* (.047) 0.25 (.169 – .177) MAX REF 0° – 8° 0.65 0.09 – 0.20 0.50 – 0.75 (.0256) 0.05 – 0.15 (.0035 – .0079) (.020 – .030) BSC (.002 – .006) 0.195 – 0.30 FE20 (CB) TSSOP 0204 (.0077 – .0118) TYP NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS 4. RECOMMENDED MINIMUM PCB METAL SIZE MILLIMETERS FOR EXPOSED PAD ATTACHMENT 2. DIMENSIONS ARE IN (INCHES) *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.150mm (.006") PER SIDE 3. DRAWING NOT TO SCALE
UFD Package 20-Lead Plastic QFN (4mm
×
5mm)
(Reference LTC DWG # 05-08-1711 Rev B) PIN 1 NOTCH R = 0.20 OR 4.00 ± 0.10 0.75 ± 0.05 R = 0.05 TYP 1.50 REF C = 0.35 (2 SIDES) 19 20 0.70 ± 0.05 0.40 ± 0.10 PIN 1 TOP MARK (NOTE 6) 1 2.65 ± 0.05 2 4.50 ± 0.05 1.50 REF 3.10 ± 0.05 5.00 ± 0.10 3.65 ± 0.05 2.50 REF (2 SIDES) 3.65 ± 0.10 PACKAGE OUTLINE 2.65 ± 0.10 0.25 ± 0.05 0.50 BSC (UFD20) QFN 0506 REV B 2.50 REF 0.200 REF R = 0.115 0.25 ± 0.05 4.10 ± 0.05 TYP 0.00 – 0.05 0.50 BSC 5.50 ± 0.05 BOTTOM VIEW—EXPOSED PAD RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED NOTE: 1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X). 5. EXPOSED PAD SHALL BE SOLDER PLATED 2. DRAWING NOT TO SCALE 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION 3. ALL DIMENSIONS ARE IN MILLIMETERS ON THE TOP AND BOTTOM OF PACKAGE 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 3834fc 28 For more information www.linear.com/LTC3834 Document Outline Features Description Applications Typical Application Absolute Maximum Ratings Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Operation Package Description Typical Application Related Parts