Datasheet LTC3528-2 (Analog Devices) - 3

LTC3528-2
ELECTRICAL CHARACTERISTICS The
l
denotes the specifications which apply over the specified operating junction temperature range, otherwise specifications are at TA = 25°C (Note 2). VIN = 1.2V, VOUT = 3.3V, unless otherwise noted. PARAMETER CONDITIONS MIN TYP MAX UNITS
Minimum Duty Cycle VFB = 1.3V l 0 % Frequency l 1.8 2.0 2.4 MHz SHDN Input High Voltage 0.88 V SHDN Input Low Voltage 0.25 V SHDN Input Current VSHDN = 1.2V 0.3 1 µA PGOOD Threshold Percentage Referenced to Feedback Voltage Falling –7 –10 –13 % PGOOD Low Voltage IPGOOD = 1mA 0.05 0.1 V VOUT = 1.6V, IPGOOD = 1mA 0.05 0.2 V PGOOD Leakage Current VPGOOD = 5.5V 0.01 1 µA
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
Note 3:
Specification is guaranteed by design and not 100% tested in may cause permanent damage to the device. Exposure to any Absolute production. Maximum Rating condition for extended periods may affect device
Note 4:
Current measurements are made when the output is not switching. reliability and lifetime.
Note 5:
This IC includes overtemperature protection that is intended
Note 2:
The LTC3528-2 is tested under pulsed load conditions such that to protect the device during momentary overload conditions. Junction TJ ≈ TA. The LTC3528E-2 is guaranteed to meet specifications from 0°C to temperature will exceed 125°C when overtemperature protection is active. 85°C junction temperature. Specifications over –40°C to 125°C operating Continuous operation above the specified maximum operating junction junction temperature range are assured by design, characterization and temperature may result in device degradation or failure. correlation with statistical process controls. Note that the maximum
Note 6:
Failure to solder the exposed backside of the package to the PC ambient temperature consistent with these specifications is determined by board ground plane will result in a thermal resistance much higher than specific operating conditions in conjunction with board layout, the rated 76°C/W. package thermal impedance and other environmental factors. The junction temperature (T
Note 7:
The IC is tested in a feedback loop to make the measurement. J, in °C) is calculated from the ambient temperature (TA, in °C) and power dissipation (PD, in Watts) according to the formula: TJ = TA + (PD • θJA) where θJA = 76°C/W is the package thermal impedance.
TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C unless otherwise noted) Efficiency vs Load Current Efficiency vs Load Current and VIN for VOUT = 1.8V and VIN for VOUT = 3V
100 1000 100 1000 EFFICIENCY 90 EFFICIENCY 90 80 100 80 100 POWER LOSS (mW) POWER LOSS (mW) 70 70 60 10 60 10 POWER 50 POWER LOSS 50 LOSS 40 1 40 1 EFFICIENCY (%) EFFICIENCY (%) 30 30 20 0.1 V 20 0.1 IN = 1V VIN = 1V 10 VIN = 1.2V 10 VIN = 1.5V VIN = 1.5V VIN = 2.4V 0 0.01 0 0.01 0.01 0.1 1 10 100 1000 0.01 0.1 1 10 100 1000 LOAD CURRENT (mA) LOAD CURRENT (mA) 35282 G01 35282 G26 35282fb 3 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Related Parts