Datasheet LTC3528, LTC3528B (Analog Devices) - 3

LTC3528/LTC3528B
ELECTRICAL CHARACTERISTICS The
l
denotes the specifications which apply over the specified operating temperature range, otherwise specifications are at TA = 25°C (Note 2). VIN = 1.2V, VOUT = 3.3V, unless otherwise noted. PARAMETER CONDITIONS MIN TYP MAX UNITS
SHDN Input High Voltage 0.88 V SHDN Input Low Voltage 0.25 V SHDN Input Current VSHDN = 1.2V 0.3 1 µA PGOOD Threshold Percentage Referenced to Feedback Voltage Falling –7 –10 –13 % PGOOD Low Voltage IPGOOD = 1mA 0.05 0.1 V VOUT = 1.6V, IPGOOD = 1mA 0.05 0.2 V PGOOD Leakage Current VPGOOD = 5.5V 0.01 1 µA
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
Note 3:
Specification is guaranteed by design and not 100% tested in may cause permanent damage to the device. Exposure to any Absolute production. Maximum Rating condition for extended periods may affect device
Note 4:
Current measurements are made when the output is not switching. reliability and lifetime.
Note 5:
This IC includes overtemperature protection that is intended
Note 2:
The LTC3528/LTC3528B are tested under pulsed load conditions to protect the device during momentary overload conditions. Junction such that TJ ≈ TA. The LTC3528E/LTC3528BE are guaranteed to meet temperature will exceed 125°C when overtemperature protection is active. specifications from 0°C to 85°C junction temperature. Specifications Continuous operation above the specified maximum operating junction over –40°C to 125°C operating junction temperature range are assured temperature may result in device degradation or failure. by design, characterization and correlation with statistical process
Note 6:
Failure to solder the exposed backside of the package to the PC controls. Note that the maximum ambient temperature consistent with board ground plane will result in a thermal resistance much higher than these specifications is determined by specific operating conditions in 76°C/W. conjunction with board layout, the rated package thermal impedance and other environmental factors. The junction temperature (T
Note 7:
The IC is tested in a feedback loop to make the measurement. J, in °C) is calculated from the ambient temperature (TA, in °C) and power dissipation (PD, in Watts) according to the formula: TJ = TA + (PD • θJA) where θJA = 76°C/W is the package thermal impedance.
TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C unless otherwise noted) Efficiency vs Load Current and VIN Efficiency vs Load Current and VIN for VOUT = 1.8V (LTC3528) for VOUT = 3V (LTC3528)
100 1000 100 1000 EFFICIENCY 90 EFFICIENCY 90 80 100 80 100 POWER LOSS (mW) POWER LOSS (mW) 70 70 60 10 60 10 POWER 50 POWER LOSS 50 LOSS 40 1 40 1 EFFICIENCY (%) EFFICIENCY (%) 30 30 20 0.1 V 20 0.1 IN = 1V VIN = 1V 10 VIN = 1.2V 10 VIN = 1.5V VIN = 1.5V VIN = 2.4V 0 0.01 0 0.01 0.01 0.1 1 10 100 1000 0.01 0.1 1 10 100 1000 LOAD CURRENT (mA) LOAD CURRENT (mA) 3528 G01 3528 G26 3528fd 3 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration order information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Related Parts