Datasheet LT1944-1 (Analog Devices) - 7
| Fabricante | Analog Devices |
| Descripción | Dual Micropower Step-Up DC/DC Converter |
| Páginas / Página | 8 / 7 — TYPICAL APPLICATIO S. Dual Output (5V, 24V) Boost Converter. PACKAGE … |
| Formato / tamaño de archivo | PDF / 151 Kb |
| Idioma del documento | Inglés |
TYPICAL APPLICATIO S. Dual Output (5V, 24V) Boost Converter. PACKAGE DESCRIPTIO. MS10 Package. 10-Lead Plastic MSOP
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LT1944-1
U TYPICAL APPLICATIO S Dual Output (5V, 24V) Boost Converter
L1 22 V µH D1 IN 24V 2.7V 1mA TO 4.2V 8 10 4.7pF 1M VIN SW1 2 1 SHDN1 FB1 C1 LT1944-1 C2 4.7µF 1µF 4 5 SHDN2 FB2 53.6k GND PGND PGND SW2 3 7 9 6 324k C3 4.7pF 1M 4.7µF L2 22µH D2 5V 40mA 1944-1 TA02 C1, C3: TAIYO YUDEN JMK212BJ475 (408) 573-4150 C2: TAIYO YUDEN TMK316BJ105 (408) 573-4150 D1, D2: CENTRAL SEMI CMDSH-3 (631) 435-1110 L1, L2: MURATA LQH3C220 (814) 237-1431
U PACKAGE DESCRIPTIO MS10 Package 10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661) 0.043 0.034 (1.10) (0.86) 0.118 ± 0.004* MAX REF (3.00 ± 0.102) 10 9 8 0.007 7 6 0° – 6° TYP (0.18) SEATING PLANE 0.021 ± 0.006 0.007 – 0.011 0.005 ± 0.002 0.193 ± 0.006 0.118 ± 0.004** (0.53 ± 0.015) (0.17 – 0.27) (0.13 ± 0.05) 0.0197 (4.90 ± 0.15) (3.00 ± 0.102) (0.50) BSC * DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE 1 2 3 4 5 ** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. MSOP (MS10) 1100 INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 7
U TYPICAL APPLICATIO S Dual Output (5V, 24V) Boost Converter
L1 22 V µH D1 IN 24V 2.7V 1mA TO 4.2V 8 10 4.7pF 1M VIN SW1 2 1 SHDN1 FB1 C1 LT1944-1 C2 4.7µF 1µF 4 5 SHDN2 FB2 53.6k GND PGND PGND SW2 3 7 9 6 324k C3 4.7pF 1M 4.7µF L2 22µH D2 5V 40mA 1944-1 TA02 C1, C3: TAIYO YUDEN JMK212BJ475 (408) 573-4150 C2: TAIYO YUDEN TMK316BJ105 (408) 573-4150 D1, D2: CENTRAL SEMI CMDSH-3 (631) 435-1110 L1, L2: MURATA LQH3C220 (814) 237-1431
U PACKAGE DESCRIPTIO MS10 Package 10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661) 0.043 0.034 (1.10) (0.86) 0.118 ± 0.004* MAX REF (3.00 ± 0.102) 10 9 8 0.007 7 6 0° – 6° TYP (0.18) SEATING PLANE 0.021 ± 0.006 0.007 – 0.011 0.005 ± 0.002 0.193 ± 0.006 0.118 ± 0.004** (0.53 ± 0.015) (0.17 – 0.27) (0.13 ± 0.05) 0.0197 (4.90 ± 0.15) (3.00 ± 0.102) (0.50) BSC * DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE 1 2 3 4 5 ** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. MSOP (MS10) 1100 INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 7