Datasheet AD810 (Analog Devices) - 4

AD810 AD810A AD810S1 Parameter Conditions VS Min Typ Max Min Typ Max Units
Turn On Time5 ZOUT = Low, See Figure 54 170 170 ns Turn Off Time ZOUT = High 100 100 ns Disable Pin Current Disable Pin = 0 V ±5 V 50 75 50 75 µA ±15 V 290 400 290 400 µA Min Disable Pin Current to Disable T ± MIN–TMAX 5 V, ± 15 V 30 30 µA POWER SUPPLY Operating Range +25°C to T ± MAX 2.5 ±18 ±2.5 ±18 V T ± MIN 3.0 ±18 ±3.5 ±18 V Quiescent Current ±5 V 6.7 7.5 6.7 7.5 mA ±15 V 6.8 8.0 6.8 8.0 mA T ± MIN–TMAX 5 V, ± 15 V 8.3 10.0 9 11.0 mA Power-Down Current ±5 V 1.8 2.3 1.8 2.3 mA ±15 V 2.1 2.8 2.1 2.8 mA NOTES 1See Analog Devices Military Data Sheet for 883B Specifications. 2Slew rate measurement is based on 10% to 90% rise time with the amplifier configured for a gain of –10. 3Voltage Swing is defined as useful operating range, not the saturation range. 4Disable guaranteed break before make. 5Turn On Time is defined with ± 5 V supplies using complementary output CMOS to drive the disable pin. Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS1 MAXIMUM POWER DISSIPATION
Supply Voltage . ± 18 V The maximum power that can be safely dissipated by the Internal Power Dissipation2 . Observe Derating Curves AD810 is limited by the associated rise in junction temperature. Output Short Circuit Duration . Observe Derating Curves For the plastic packages, the maximum safe junction tempera- Common-Mode Input Voltage . ± VS ture is 145°C. For the cerdip package, the maximum junction Differential Input Voltage . ± 6 V temperature is 175°C. If these maximums are exceeded momen- Storage Temperature Range tarily, proper circuit operation will be restored as soon as the die Plastic DIP . –65°C to +125°C temperature is reduced. Leaving the device in the “overheated” Cerdip . –65°C to +150°C condition for an extended period can result in device burnout. Small Outline IC . –65°C to +125°C To ensure proper operation, it is important to observe the Operating Temperature Range derating curves. AD810A . –40°C to +85°C
2.4
AD810S . –55°C to +125°C
2.2
Lead Temperature Range (Soldering 60 sec) . +300°C
2.0 8-PIN MINI-DIP 1.8
NOTES 1
1.6
Stresses above those listed under “Absolute Maximum Ratings” may cause
1.4
permanent damage to the device. This is a stress rating only and functional
8-PIN 1.2 CERDIP
operation of the device at these or any other conditions above those indicated in the
1.0 8-PIN
operational section of this specification is not implied. Exposure to absolute
TOTAL POWER 8-PIN MINI-DIP 0.8
maximum raring conditions for extended periods may affect device reliability.
DISSIPATION – Watts SOIC 0.6
28-Pin Plastic Package: θJA = 90°C/Watt; 8-Pin Cerdip Package: θJA = 110°C/Watt;
0.4
8-Pin SOIC Package: θJA = 150°C/Watt.
–60 –40 –20 0 20 40 60 80 100 120 140 AMBIENT TEMPERATURE – °C ESD SUSCEPTIBILITY
ESD (electrostatic discharge) sensitive device. Electrostatic Maximum Power Dissipation vs. Temperature charges as high as 4000 volts, which readily accumulate on the human body and on test equipment, can discharge without While the AD810 is internally short circuit protected, this may detection. Although the AD810 features ESD protection not be sufficient to guarantee that the maximum junction circuitry, permanent damage may still occur on these devices if temperature is not exceeded under all conditions. they are subjected to high energy electrostatic discharges.
SEE TEXT 0.1µF +V
Therefore, proper ESD precautions are recommended to avoid
S 10k
Ω any performance degradation or loss of functionality.
7 1 ORDERING GUIDE 2 5 AD810 6 Temperature Package Package 3 4 0.1µF Model Range Description Option –VS
AD810AN –40°C to +85°C 8-Pin Plastic DIP N-8 AD810AR –40°C to +85°C 8-Pin Plastic SOIC R-8 Offset Null Configuration AD810AR-REEL –40°C to +85°C 8-Pin Plastic SOIC R-8 5962-9313201MPA –55°C to +125°C 8-Pin Cerdip Q-8 REV. A –3–