Datasheet AD9631, AD9632 (Analog Devices) - 5

Data Sheet AD9631/AD9632 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter Rating Table 3.
Supply Voltage (+VS to −VS) 12.6 V
Package Type1 θJA Unit
Voltage Swing × Bandwidth Product 550 V × MHz 8-Lead PDIP (N) 90 °C/W Internal Power Dissipation 8-Lead SOIC (R) 140 °C/W PDIP (N) 1.3 W 1 For device in free air. SOIC (R) 0.9 W Input Voltage (Common Mode) ±V
MAXIMUM POWER DISSIPATION
S Differential Input Voltage ±1.2 V The maximum power that can be safely dissipated by these Output Short Circuit Duration Observe Power devices is limited by the associated rise in junction temperature. Derating Curves The maximum safe junction temperature for plastic encapsu- Storage Temperature Range −65°C to +125°C lated devices is determined by the glass transition temperature Operating Temperature Range (A Grade) −40°C to +85°C of the plastic, approximately 150°C. Exceeding this limit tempo- Lead Temperature Range (Soldering 10 sec) 300°C rarily may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Stresses above those listed under Absolute Maximum Ratings Exceeding a junction temperature of 175°C for an extended may cause permanent damage to the device. This is a stress period can result in device failure. rating only; functional operation of the device at these or any other conditions above those indicated in the operational While the AD9631 and AD9632 are internally short circuit section of this specification is not implied. Exposure to absolute protected, this may not be sufficient to guarantee that the max- maximum rating conditions for extended periods may affect imum junction temperature (150°C) is not exceeded under all device reliability. conditions. To ensure proper operation, it is necessary to observe the maximum power derating curves.
METALLIZATION PHOTO 2.0 –IN +VS TJ = 150°C 2 7 8-LEAD PDIP PACKAGE ) W ( N 1.5 IO T A IP ISS D 0.046 R 1.0 E (1.17) 6 W OUT 8-LEAD SOIC PACKAGE M PO MU 0.5 XI MA 3 4 AD9631 0 +IN –V
004
S –50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90
1-
0.050 (1.27) AMBIENT TEMPERATURE (°C) –IN +VS
0060
2 7
Figure 4. Maximum Power Dissipation vs. Temperature
ESD CAUTION 0.046 (1.17) 6 OUT
03
3 4 AD9632
0 1-
+IN –VS
060 0 Figure 3. Dimensions shown in inches and (millimeters) Connect Substrate to −VS Rev. D | Page 5 of 20 Document Outline Features Applications General Description Pin Configuration Table of Contents Revision History Specifications Electrical Characteristics Absolute Maximum Ratings Metallization Photo Thermal Resistance Maximum Power Dissipation ESD Caution Typical Performance Characteristics Theory of Operation General Feedback Resistor Choice Pulse Response Large Signal Performance Power Supply Bypassing Driving Capacitive Loads Applications Information Operation as a Video Line Driver Active Filters Analog-to-Digital Converter (ADC) Driver Layout Considerations Outline Dimensions Ordering Guide