Datasheet AD8005 (Analog Devices) - 6

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Data Sheet AD8005 ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION Table 3.
The maximum power that can be safely dissipated by the AD8005
Parameter Rating
is limited by the associated rise in junction temperature. The Supply Voltage 12.6 V maximum safe junction temperature for plastic encapsulated Internal Power Dissipation1 devices is determined by the glass transition temperature of the PDIP Package (N-8) 1.3 Watts plastic, approximately +150°C. Exceeding this limit temporarily SOIC_N (R-8) 0.75 Watts causes a shift in parametric performance due to a change in the SOT-23 Package (RJ-5) 0.5 Watts stresses exerted on the die by the package. Exceeding a junction Input Voltage (Common Mode) ±VS ± 1 V temperature of +175°C for an extended period can result in Differential Input Voltage ±3.5 V device failure. Output Short Circuit Duration Observe Power Derating Curves Storage Temperature Range –65°C to +125°C While the AD8005 is internally short circuit protected, this is Operating Temperature Range –40°C to +85°C not sufficient to guarantee that the maximum junction temper- Lead Temperature Range +300°C ature (+150°C) is not exceeded under all conditions. To ensure (Soldering 10 sec) proper operation, it is necessary to observe the maximum power derating curves shown in Figure 5. 1 See Table 4.
2.0
Stresses above those listed under Absolute Maximum Ratings
TJ = 150°C
may cause permanent damage to the device. This is a stress
) 8-LEAD PDIP PACKAGE
rating only; functional operation of the device at these or any
(W N 1.5
other conditions above those indicated in the operational
IO T A
section of this specification is not implied. Exposure to absolute
IP 8-LEAD SOIC_N PACKAGES
maximum rating conditions for extended periods may affect
ISS D 1.0
device reliability.
R E W THERMAL RESISTANCE M PO
θ
MU 0.5
JA is specified for device in free air.
5-LEAD SOT-23 PACKAGE XI MA Table 4. Thermal Resistance Package Type θJA Unit 0 –50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90
005 8-Lead PDIP Package 90 °C/W 46-
AMBIENT TEMPERATURE (°C)
121 8-Lead SOIC_N Package 155 °C/W Figure 5. Maximum Power Dissipation vs. Temperature 5-Lead SOT-23 Package 240 °C/W
ESD CAUTION
Rev. B | Page 5 of 16 Document Outline Features Applications General Description Functional Block Diagrams Table of Contents Revision History Specifications ±5 V Supplies +5 V Supply Absolute Maximum Ratings Thermal Resistance Maximum Power Dissipation ESD Caution Typical Performance Characteristics Applications Driving Capicative Loads Single-Supply Level Shifter Single-Ended-to-Differential Conversion Layout Considerations Increasing Feedback Resistors Outline Dimensions Ordering Guide