Datasheet ADA4860-1 (Analog Devices) - 6

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ADA4860-1 ABSOLUTE MAXIMUM RATINGS Table 3.
The power dissipated in the package (PD) for a sine wave and a
Parameter Rating
resistor load is the total power consumed from the supply Supply Voltage 12.6 V minus the load power. Power Dissipation See Figure 3 P Common-Mode Input Voltage −V D = Total Power Consumed − Load Power S + 1 V to +VS − 1 V Differential Input Voltage ±V 2 S V P = V × I – D ( SUPPLYVOLTAGE SUPPLYCURRENT) OUT Storage Temperature Range −65°C to +125°C RL Operating Temperature Range −40°C to +105°C Lead Temperature JEDEC J-STD-20 RMS output voltages should be considered. Junction Temperature 150°C Airflow across the ADA4860-1 helps remove heat from the Stresses above those listed under Absolute Maximum Ratings package, effectively reducing θJA. In addition, more metal may cause permanent damage to the device. This is a stress directly in contact with the package leads and through holes rating only; functional operation of the device at these or any under the device reduces θJA. other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute Figure 3 shows the maximum safe power dissipation in the maximum rating conditions for extended periods may affect package vs. the ambient temperature for the 6-lead SOT-23 device reliability. (170°C/W) on a JEDEC standard 4-layer board. θJA values are approximations.
THERMAL RESISTANCE 2.0
θJA is specified for the worst-case conditions, that is, θJA is specified for device soldered in circuit board for surface-mount
)
packages.
(W N 1.5 IO Table 4. Thermal Resistance T PA Package Type θJA Unit ISSI
6-lead SOT-23 170 °C/W
D 1.0 R E W Maximum Power Dissipation M PO
The maximum safe power dissipation for the ADA4860-1 is
MU 0.5 XI
limited by the associated rise in junction temperature (TJ) on
MA
the die. At approximately 150°C, which is the glass transition 002 temperature, the plastic changes its properties. Even temporarily
0
05709-
–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 100 110
exceeding this temperature limit can change the stresses that the
AMBIENT TEMPERATURE (°C)
package exerts on the die, permanently shifting the parametric Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board performance of the amplifiers. Exceeding a junction temperature of 150°C for an extended period can result in changes in silicon devices, potentially causing degradation or loss of functionality.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. 0 | Page 5 of 20 Document Outline FEATURES APPLICATIONS PIN CONFIGURATION GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Maximum Power Dissipation ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS APPLICATION INFORMATION POWER SUPPLY BYPASSING FEEDBACK RESISTOR SELECTION DRIVING CAPACITIVE LOADS POWER DOWN PIN VIDEO AMPLIFIER SINGLE-SUPPLY OPERATION OPTIMIZING FLATNESS AND BANDWIDTH LAYOUT AND CIRCUIT BOARD PARASITICS OUTLINE DIMENSIONS ORDERING GUIDE