Datasheet ADA4895-1, ADA4895-2 (Analog Devices) - 7

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Data Sheet ADA4895-1/ADA4895-2 ABSOLUTE MAXIMUM RATINGS
PD = Quiescent Power + (Total Drive Power − Load Power)
Table 5. Parameter Rating
The quiescent power dissipation is the voltage between the supply Supply Voltage 11 V pins (±VS) multiplied by the quiescent current (IS). Power Dissipation See Figure 4  V V  V 2 = × + × − D P (V I ) S OUT OUT Common-Mode Input Voltage −V S − 0.7 V to +VS + 0.7 V S S   2 R  L  RL Differential Input Voltage ±0.7 V Storage Temperature Range −65°C to +125°C Consider rms output voltages. If RL is referenced to −VS, as in Operating Temperature Range −40°C to +125°C single-supply operation, the total drive power is VS × IOUT. In Lead Temperature (Soldering 10 sec) 300°C single-supply operation with RL referenced to −VS, the worst Junction Temperature 150°C case is VOUT = VS/2. If the rms signal levels are indeterminate, consider the worst case, Stresses at or above those listed under Absolute Maximum when V Ratings may cause permanent damage to the product. This is a OUT = VS/4 with RL referenced to midsupply. stress rating only; functional operation of the product at these V 2 /4 = × + D P (V I ) ( S ) or any other conditions above those indicated in the operational S S L R section of this specification is not implied. Operation beyond Airflow increases heat dissipation, effectively reducing θ the maximum operating conditions for extended periods may JA. Also, more metal directly in contact with the package leads reduces θ affect product reliability. JA.
THERMAL RESISTANCE
Figure 4 shows the maximum safe power dissipation in the package vs. the ambient temperature on a JEDEC standard, 4-layer board. θJA is specified for the worst-case conditions, that is, θJA is specified θJA values are approximations. for a device soldered in a circuit board for surface-mount
1.6
packages. Table 6 lists the θJA for the ADA4895-1/ADA4895-2.
1.4 Table 6. Thermal Resistance W) ( 1.2 ADA4895-1 (SOIC) Package Type θJA Unit TION
8-Lead Single SOIC 133 °C/W
PA 1.0 ADA4895-1 (SOT-23) ISSI
6-Lead Single SOT-23 150 °C/W
D 0.8
10-Lead Dual MSOP 210 °C/W
ER W 0.6 MAXIMUM POWER DISSIPATION M PO MU 0.4 ADA4895-2 (MSOP)
The maximum safe power dissipation for the ADA4895-1/
XI MA
ADA4895-2 is limited by the associated rise in junction
0.2
temperature (TJ) on the die. At approximately 150°C, which is the
0
glass transition temperature, the properties of the plastic change.
–40 –20 0 20 40 60 80 100 120 –30 –10 10 30 50 70 90 110
003 Even temporarily exceeding this temperature limit can change
AMBIENT TEMPERATURE (°C)
10186- the stresses that the package exerts on the die, permanently Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board shifting the parametric performance of the ADA4895-1/
ESD CAUTION
ADA4895-2. Exceeding a junction temperature of 175°C for an extended period of time can result in changes in silicon devices, potentially causing degradation or loss of functionality. The power dissipated in the package (PD) is the sum of the quiescent power dissipation and the power dissipated in the die due to the ADA4895-1/ADA4895-2 drive at the output. Rev. B | Page 7 of 24 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAMS COMPANION PRODUCTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ±5 V (OR +10 V) SUPPLY ±2.5 V (OR +5 V) SUPPLY ±1.5 V (OR +3 V) SUPPLY ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE MAXIMUM POWER DISSIPATION ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION AMPLIFIER DESCRIPTION INPUT PROTECTION DISABLE OPERATION DC ERRORS BIAS CURRENT CANCELLATION NOISE CONSIDERATIONS APPLICATIONS INFORMATION USING THE ADA4895-1/ADA4895-2 AT A GAIN < +10 HIGH GAIN BANDWIDTH APPLICATION FEEDBACK CAPACITOR APPLICATION WIDEBAND PHOTOMULTIPLIER PREAMPLIFIER LAYOUT CONSIDERATIONS Ground Plane Power Supply Bypassing OUTLINE DIMENSIONS ORDERING GUIDE