Datasheet MCP6291, MCP6291R, MCP6292, MCP6293, MCP6294, MCP6295 (Microchip) - 7

MCP6291/1R/2/3/4/5 TYPICAL PERFORMANCE CURVES (CONTINUED) Note:
Unless otherwise indicated, T ≈ A = +25°C, VDD = +2.4V to +5.5V, VSS = GND, VCM = VDD/2, VOUT VDD/2, VL = VDD/2, RL = 10 kΩ to VL, CL = 60 pF, and CS is tied low.
1.6 1000 1.4 t 1.2 r) rren om (mV) 100 ifie 1.0 ro Cu d 0.8 nt Ampl T Hea A = +125°C sce A/ 0.6 T ie A = +85°C (m 10 0.4 TA = +25°C Qu V T OL - VSS A = -40°C Voltage 0.2 VDD - VOH 0.0 1 Ouput 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0.01 0.1 1 10 Power Supply Voltage (V) Output Current Magnitude (mA) FIGURE 2-13:
Quiescent Current vs.
FIGURE 2-16:
Output Voltage Headroom Power Supply Voltage. vs. Output Current Magnitude.
120 0 16 90 t 100 -30 14 85 uc B) Gain GBWP, VDD = 5.5V d 12 GBWP, V 80 80 ( -60 DD = 2.4V in Phase a 10 h Prod 75 in (°) 60 -90 z) 8 widt 70 40 (MH oop G -120 oop Phase (°) nd e Marg 6 65 -L -L as 20 n en -150 e p p 4 in Ba 60 Ph O O PM, VDD = 5.5V 0 -180 Ga 2 55 PM, VDD = 2.4V -20 -210 0 50
1 -0 00 01 02 03 04 05 06 07 08 E + + + + + + + + + E E E E E E E E E 1. 1. 1. 1. 1. 1. 1. 1. 1. 1.
0.1 1 10 100 1k 10k 100k 1M 10M 100M -50 -25 0 25 50 75 100 125 Frequency (Hz) Ambient Temperature (°C) FIGURE 2-14:
Open-Loop Gain, Phase vs.
FIGURE 2-17:
Gain Bandwidth Product, Frequency. Phase Margin vs. Ambient Temperature.
10 12 e Falling Edge, V 10 DD = 5.5V V ltag DD = 2.4V ) s) Vo P 8 ut P- V p DD = 5.5V (V/µ 1 VDD = 2.4V 6 ate Swing (V 4 Slew R Rising Edge, VDD = 5.5V aximum Out 2 VDD = 2.4V M 0 0.1
03 04 05 06 07 + + + + + E E E E E 1. 1. 1. 1. 1.
1k 10k 100k 1M 10M -50 -25 0 25 50 75 100 125 Frequency (Hz) Ambient Temperature (°C) FIGURE 2-15:
Maximum Output Voltage
FIGURE 2-18:
Slew Rate vs. Ambient Swing vs. Frequency. Temperature. © 2007 Microchip Technology Inc. DS21812E-page 7 Document Outline 1.0 Electrical Characteristics FIGURE 1-1: Timing Diagram for the Chip Select (CS) pin on the MCP6293 and MCP6295. 1.1 Test Circuits FIGURE 1-2: AC and DC Test Circuit for Most Non-Inverting Gain Conditions. FIGURE 1-3: AC and DC Test Circuit for Most Inverting Gain Conditions. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Bias Current at TA = +85 ˚C. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage at VDD = 2.4V. FIGURE 2-4: Input Offset Voltage Drift. FIGURE 2-5: Input Bias Current at TA = +125 ˚C. FIGURE 2-6: Input Offset Voltage vs. Common Mode Input Voltage at VDD = 5.5V. FIGURE 2-7: Input Offset Voltage vs. Output Voltage. FIGURE 2-8: CMRR, PSRR vs. Frequency. FIGURE 2-9: Input Bias, Offset Currents vs. Common Mode Input Voltage at TA = +85˚C. FIGURE 2-10: Input Bias, Input Offset Currents vs. Ambient Temperature. FIGURE 2-11: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-12: Input Bias, Offset Currents vs. Common Mode Input Voltage at TA = +125˚C. FIGURE 2-13: Quiescent Current vs. Power Supply Voltage. FIGURE 2-14: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-15: Maximum Output Voltage Swing vs. Frequency. FIGURE 2-16: Output Voltage Headroom vs. Output Current Magnitude. FIGURE 2-17: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-18: Slew Rate vs. Ambient Temperature. FIGURE 2-19: Input Noise Voltage Density vs. Frequency. FIGURE 2-20: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-21: Quiescent Current vs. Chip Select (CS) Voltage at VDD = 2.4V (MCP6293 and MCP6295 only). FIGURE 2-22: Input Noise Voltage Density vs. Common Mode Input Voltage at 10 kHz. FIGURE 2-23: Channel-to-Channel Separation vs. Frequency (MCP6292, MCP6294 and MCP6295 only). FIGURE 2-24: Quiescent Current vs. Chip Select (CS) Voltage at VDD = 5.5V (MCP6293 and MCP6295 only). FIGURE 2-25: Large-Signal Non-inverting Pulse Response. FIGURE 2-26: Small-Signal Non-inverting Pulse Response. FIGURE 2-27: Chip Select (CS) to Amplifier Output Response Time at VDD = 2.4V (MCP6293 and MCP6295 only). FIGURE 2-28: Large-Signal Inverting Pulse Response. FIGURE 2-29: Small-Signal Inverting Pulse Response. FIGURE 2-30: Chip Select (CS) to Amplifier Output Response Time at VDD = 5.5V (MCP6293 and MCP6295 only). FIGURE 2-31: Measured Input Current vs. Input Voltage (below VSS). FIGURE 2-32: The MCP6291/1R/2/3/4/5 Show No Phase Reversal. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table for Single Op Amps TABLE 3-2: Pin Function Table for Dual and Quad Op Amps 3.1 Analog Outputs 3.2 Analog Inputs 3.3 MCP6295’s VOUTA/VINB+ Pin 3.4 Chip Select Digital Input 3.5 Power Supply Pins 4.0 Application Information 4.1 Rail-to-Rail Inputs FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-3: Output Resistor, RISO stabilizes large capacitive loads. FIGURE 4-4: Recommended RISO Values for Capacitive Loads. 4.4 MCP629X Chip Select 4.5 Cascaded Dual Op Amps (MCP6295) FIGURE 4-5: Cascaded Gain Amplifier. 4.6 Supply Bypass 4.7 Unused Op Amps FIGURE 4-6: Unused Op Amps. 4.8 PCB Surface Leakage FIGURE 4-7: Example Guard Ring Layout for Inverting Gain. 4.9 Application Circuits FIGURE 4-8: Multiple Feedback Low- Pass Filter. FIGURE 4-9: Photodiode Amplifier. FIGURE 4-10: Isolating the Load with a Buffer. FIGURE 4-11: Cascaded Gain Circuit Configuration. FIGURE 4-12: Difference Amplifier Circuit. FIGURE 4-13: Buffered Non-inverting Integrator with Chip Select. FIGURE 4-14: Integrator Circuit with Active Compensation. FIGURE 4-15: Second-Order Multiple Feedback Low-Pass Filter with an Extra Pole- Zero Pair. FIGURE 4-16: Second-Order Sallen-Key Low-Pass Filter with an Extra Pole-Zero Pair and Chip Select. FIGURE 4-17: Capacitorless Second-Order Low-Pass Filter with Chip Select. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Mindi™ Simulator Tool 5.4 MAPS (Microchip Advanced Part Selector) 5.5 Analog Demonstration and Evaluation Boards 5.6 Application Notes 6.0 Packaging Information 6.1 Package Marking Information