Datasheet MCP6H81, MCP6H82, MCP6H84 (Microchip) - 10

MCP6H81/2/4 Note:
Unless otherwise indicated, T  A = +25°C, VDD = +3.5V to +12V, VSS = GND, VCM = VDD/2 - 1.4V, VOUT VDD/2, VL = VDD/2, RL = 10 kto VL and CL = 60 pF.
140 60 130 50 120 40 110 Circuit Current 30 (mA) 100 T = +125°C A 20 T = +85°C A annel to Channel eparation (dB) 90 T = +25°C A h S 90 h S t Short T = -40°C C Input Referred 10 A 80 Outpu 0 70 0 2 4 6 8 10 12 100 1000 100 1k 10000 10k 100000 100k 1000000 1M Frequency (Hz) Power Supply Voltage (V) FIGURE 2-19:
Channel-to-Channel
FIGURE 2-22:
Output Short Circuit Current Separation vs. Frequency (MCP6H82/4 only). vs. Power Supply Voltage.
9.0 180 100 8.0 160 ) P-P 7.0 Gain Bandw Gain Band idth i dth Product 140 V = 12V 6.0 120 DD ing (V 10 V = 5V 5.0 100 gin (°) Sw DD idth Product 4.0 80 (MHz) V = 3.5V ltage DD andw 3.0 60 ase Mar o B 1 h t V 2.0 40 P Phase Margin Gain 1.0 V = 3.5V DD 20 Outpu 0.0 0 0.1 1000 10000 100000 1000000 10000000 1k 10k 100k 1M 10M -50 -25 0 25 50 75 100 125 Ambient Temperature (°C) Frequency (Hz) FIGURE 2-20:
Gain Bandwidth Product,
FIGURE 2-23:
Output Voltage Swing vs. Phase Margin vs. Ambient Temperature. Frequency.
9.0 180 1000 8.0 160 V = 12V DD 7.0 140 Gain Bandwidth Product 100 6.0 120 gin (°) 5.0 100 idth Product V - V 10 OL SS 4.0 80 (MHz) 3.0 60 Bandw hase Mar oltage Headroom (mV) n V 2.0 Phase Margin 40 P 40 1 Gai 1.0 V = 12V DD 20 V - V DD OH 0.0 0 Output 0.1 -50 -25 0 25 50 75 100 125 0.01 0.1 1 10 100 Ambient Temperature (°C) Output Current (mA) FIGURE 2-21:
Gain Bandwidth Product,
FIGURE 2-24:
Output Voltage Headroom Phase Margin vs. Ambient Temperature. vs. Output Current. DS22320B-page 10  2012 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings 1.2 Test Circuits FIGURE 1-1: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-5: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-6: Input Offset Voltage vs. Output Voltage. FIGURE 2-7: Input Offset Voltage vs. Power Supply Voltage. FIGURE 2-8: Input Noise Voltage Density vs. Frequency. FIGURE 2-9: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-10: CMRR, PSRR vs. Frequency. FIGURE 2-11: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-12: Input Bias, Offset Currents vs. Ambient Temperature. FIGURE 2-13: Input Bias Current vs. Common Mode Input Voltage. FIGURE 2-14: Quiescent Current vs. Ambient Temperature. FIGURE 2-15: Quiescent Current vs. Power Supply Voltage. FIGURE 2-16: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-17: DC Open-Loop Gain vs. Power Supply Voltage. FIGURE 2-18: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-19: Channel-to-Channel Separation vs. Frequency (MCP6H82/4 only). FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-21: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-22: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-23: Output Voltage Swing vs. Frequency. FIGURE 2-24: Output Voltage Headroom vs. Output Current. FIGURE 2-25: Output Voltage Headroom vs. Output Current. FIGURE 2-26: Output Voltage Headroom vs. Output Current. FIGURE 2-27: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-28: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-29: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-30: Slew Rate vs. Ambient Temperature. FIGURE 2-31: Slew Rate vs. Ambient Temperature. FIGURE 2-32: Small Signal Non-Inverting Pulse Response. FIGURE 2-33: Small Signal Inverting Pulse Response. FIGURE 2-34: Large Signal Non-Inverting Pulse Response. FIGURE 2-35: Large Signal Inverting Pulse Response. FIGURE 2-36: The MCP6H81/2/4 Shows No Phase Reversal. FIGURE 2-37: Closed Loop Output Impedance vs. Frequency. FIGURE 2-38: Measured Input Current vs. Input Voltage (below VSS). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins 3.4 Exposed Thermal Pad (EP) 4.0 Application Information 4.1 Inputs FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-4: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. 4.4 Supply Bypass 4.5 Unused Op Amps 4.6 PCB Surface Leakage FIGURE 4-6: Unused Op Amps. FIGURE 4-7: Example Guard Ring Layout for Inverting Gain. 4.7 Application Circuits FIGURE 4-8: High Side Current Sensing Using Difference Amplifier. FIGURE 4-9: Active Full-Wave Rectifier. FIGURE 4-10: Triangle Waves Generator. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 MAPS (Microchip Advanced Part Selector) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service