Datasheet MCP6441, MCP6442, MCP6444 (Microchip) - 8
| Fabricante | Microchip |
| Descripción | The MCP6441 device is a single nanopower operational amplifier (op amp), which has low quiescent current (450 nA, typical) and rail-to-rail input and output operation |
| Páginas / Página | 46 / 8 — MCP6441/2/4. Note:. ) 1000. Phase Margin. VDD - VOH @ VDD = 1.4V. VOL - … |
| Formato / tamaño de archivo | PDF / 2.3 Mb |
| Idioma del documento | Inglés |
MCP6441/2/4. Note:. ) 1000. Phase Margin. VDD - VOH @ VDD = 1.4V. VOL - VSS @ VDD = 1.4V. 100. z) 10. Gain Bandwidth Product. ead. idt. e H
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MCP6441/2/4 Note:
Unless otherwise indicated, T ≈ A = +25°C, VDD = +1.4V to +6.0V, VSS = GND, VCM = VDD/2, VOUT VDD/2, VL = VDD/2, RL = 1 MΩ to VL and CL = 60 pF.
18 90 ) 1000 Phase Margin V 16 ct 80 m VDD - VOH @ VDD = 1.4V u ( d 14 70 m VOL - VSS @ VDD = 1.4V o ) o 100 12 (° Pr 60 ro h in z) 10 Gain Bandwidth Product rg ead idt 50 w H 10 (k 8 40 e H nd e Ma a ag 6 30 as lt VDD - VOH @ VDD = 6.0V B h P o VOL - VSS @ VDD = 6.0V in 4 20 1 V t V Ga DD = 1.4V u 2 10 tp R u L = 10 kΩ 0 0 O 0.1 -50 -25 0 25 50 75 100 125 1 0. 001 10 0. 0 1 1 00 1 0 1 0 0 1 00 0 Ambient Temperature (°C) Output Current (mA) FIGURE 2-19:
Gain Bandwidth Product,
FIGURE 2-22:
Output Voltage Headroom Phase Margin vs. Ambient Temperature. vs. Output Current.
35 25 nt ) rre 30 m V VDD - VOH @ VDD = 6.0V u o 20 C V T ro (m OL - VSS @ VDD = 6.0V t 25 A = -40°C T SS A = +25°C ead ) 20 ircui T H - V 15 A A = +85°C T e t C A = +125°C (m 15 ag V OL lt hor o or 10 10 t S t V OH u u tp 5 tp - V 5 V u DD - VOH @ VDD = 1.4V O Ou V DD VOL - VSS @ VDD = 1.4V 0 0 5 5 0 5 0 5 0 0 0 0 0. 0. 1.0 1. 2. 2. 3. 3. 4. 4.5 5. 5.5 6. -50 -25 0 25 50 75 100 125 Power Supply Voltage (V) Ambient Temperature (°C) FIGURE 2-20:
Output Short Circuit Current
FIGURE 2-23:
Output Voltage Headroom vs. Power Supply Voltage. vs. Ambient Temperature.
10 6 ) V P DD = 6.0V Falling Edge, VDD = 6.0V P- 5 Rising Edge, V (V DD = 6.0V g s) in /m 4 w VDD = 1.4V S (V 1 te 3 a ltage R o w 2 t V le u S tp 1 Falling Edge, VDD = 1.4V u Rising Edge, V O DD = 1.4V 0.1 0 10 1 100 100 10 00 1k 1 1 0 0 0 k 00 -50 -25 0 25 50 75 100 125 Frequency (Hz) Ambient Temperature (°C) FIGURE 2-21:
Output Voltage Swing vs.
FIGURE 2-24:
Slew Rate vs. Ambient Frequency. Temperature. DS22257C-page 8 © 2010-2012 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 6.0V. FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 1.4V. FIGURE 2-5: Input Offset Voltage vs. Output Voltage. FIGURE 2-6: Input Offset Voltage vs. Power Supply Voltage. FIGURE 2-7: Input Noise Voltage Density vs. Frequency. FIGURE 2-8: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-9: CMRR, PSRR vs. Frequency. FIGURE 2-10: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-11: Input Bias, Offset Current vs. Ambient Temperature. FIGURE 2-12: Input Bias Current vs. Common Mode Input Voltage. FIGURE 2-13: Quiescent Current vs. Ambient Temperature. FIGURE 2-14: Quiescent Current vs. Power Supply Voltage. FIGURE 2-15: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-16: DC Open-Loop Gain vs. Power Supply Voltage. FIGURE 2-17: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-18: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-19: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-20: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-21: Output Voltage Swing vs. Frequency. FIGURE 2-22: Output Voltage Headroom vs. Output Current. FIGURE 2-23: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-24: Slew Rate vs. Ambient Temperature. FIGURE 2-25: Small Signal Non-Inverting Pulse Response. FIGURE 2-26: Small Signal Inverting Pulse Response. FIGURE 2-27: Large Signal Non-Inverting Pulse Response. FIGURE 2-28: Large Signal Inverting Pulse Response. FIGURE 2-29: The MCP6441/2/4 Device Shows No Phase Reversal. FIGURE 2-30: Closed Loop Output Impedance vs. Frequency. FIGURE 2-31: Measured Input Current vs. Input Voltage (below VSS). FIGURE 2-32: Channel-to-Channel Separation vs. Frequency (MCP6442/4 only). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 4.0 Application Information FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Protecting the Analog Inputs. FIGURE 4-4: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. FIGURE 4-6: Example Guard Ring Layout for Inverting Gain. FIGURE 4-7: Battery Current Sensing. FIGURE 4-8: Precision Half-Wave Rectifier. FIGURE 4-9: Two Op Amp Instrumentation Amplifier. 5.0 Design Aids 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service
Unless otherwise indicated, T ≈ A = +25°C, VDD = +1.4V to +6.0V, VSS = GND, VCM = VDD/2, VOUT VDD/2, VL = VDD/2, RL = 1 MΩ to VL and CL = 60 pF.
18 90 ) 1000 Phase Margin V 16 ct 80 m VDD - VOH @ VDD = 1.4V u ( d 14 70 m VOL - VSS @ VDD = 1.4V o ) o 100 12 (° Pr 60 ro h in z) 10 Gain Bandwidth Product rg ead idt 50 w H 10 (k 8 40 e H nd e Ma a ag 6 30 as lt VDD - VOH @ VDD = 6.0V B h P o VOL - VSS @ VDD = 6.0V in 4 20 1 V t V Ga DD = 1.4V u 2 10 tp R u L = 10 kΩ 0 0 O 0.1 -50 -25 0 25 50 75 100 125 1 0. 001 10 0. 0 1 1 00 1 0 1 0 0 1 00 0 Ambient Temperature (°C) Output Current (mA) FIGURE 2-19:
Gain Bandwidth Product,
FIGURE 2-22:
Output Voltage Headroom Phase Margin vs. Ambient Temperature. vs. Output Current.
35 25 nt ) rre 30 m V VDD - VOH @ VDD = 6.0V u o 20 C V T ro (m OL - VSS @ VDD = 6.0V t 25 A = -40°C T SS A = +25°C ead ) 20 ircui T H - V 15 A A = +85°C T e t C A = +125°C (m 15 ag V OL lt hor o or 10 10 t S t V OH u u tp 5 tp - V 5 V u DD - VOH @ VDD = 1.4V O Ou V DD VOL - VSS @ VDD = 1.4V 0 0 5 5 0 5 0 5 0 0 0 0 0. 0. 1.0 1. 2. 2. 3. 3. 4. 4.5 5. 5.5 6. -50 -25 0 25 50 75 100 125 Power Supply Voltage (V) Ambient Temperature (°C) FIGURE 2-20:
Output Short Circuit Current
FIGURE 2-23:
Output Voltage Headroom vs. Power Supply Voltage. vs. Ambient Temperature.
10 6 ) V P DD = 6.0V Falling Edge, VDD = 6.0V P- 5 Rising Edge, V (V DD = 6.0V g s) in /m 4 w VDD = 1.4V S (V 1 te 3 a ltage R o w 2 t V le u S tp 1 Falling Edge, VDD = 1.4V u Rising Edge, V O DD = 1.4V 0.1 0 10 1 100 100 10 00 1k 1 1 0 0 0 k 00 -50 -25 0 25 50 75 100 125 Frequency (Hz) Ambient Temperature (°C) FIGURE 2-21:
Output Voltage Swing vs.
FIGURE 2-24:
Slew Rate vs. Ambient Frequency. Temperature. DS22257C-page 8 © 2010-2012 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 6.0V. FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 1.4V. FIGURE 2-5: Input Offset Voltage vs. Output Voltage. FIGURE 2-6: Input Offset Voltage vs. Power Supply Voltage. FIGURE 2-7: Input Noise Voltage Density vs. Frequency. FIGURE 2-8: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-9: CMRR, PSRR vs. Frequency. FIGURE 2-10: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-11: Input Bias, Offset Current vs. Ambient Temperature. FIGURE 2-12: Input Bias Current vs. Common Mode Input Voltage. FIGURE 2-13: Quiescent Current vs. Ambient Temperature. FIGURE 2-14: Quiescent Current vs. Power Supply Voltage. FIGURE 2-15: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-16: DC Open-Loop Gain vs. Power Supply Voltage. FIGURE 2-17: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-18: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-19: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-20: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-21: Output Voltage Swing vs. Frequency. FIGURE 2-22: Output Voltage Headroom vs. Output Current. FIGURE 2-23: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-24: Slew Rate vs. Ambient Temperature. FIGURE 2-25: Small Signal Non-Inverting Pulse Response. FIGURE 2-26: Small Signal Inverting Pulse Response. FIGURE 2-27: Large Signal Non-Inverting Pulse Response. FIGURE 2-28: Large Signal Inverting Pulse Response. FIGURE 2-29: The MCP6441/2/4 Device Shows No Phase Reversal. FIGURE 2-30: Closed Loop Output Impedance vs. Frequency. FIGURE 2-31: Measured Input Current vs. Input Voltage (below VSS). FIGURE 2-32: Channel-to-Channel Separation vs. Frequency (MCP6442/4 only). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 4.0 Application Information FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Protecting the Analog Inputs. FIGURE 4-4: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. FIGURE 4-6: Example Guard Ring Layout for Inverting Gain. FIGURE 4-7: Battery Current Sensing. FIGURE 4-8: Precision Half-Wave Rectifier. FIGURE 4-9: Two Op Amp Instrumentation Amplifier. 5.0 Design Aids 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service