Datasheet MCP6441, MCP6442, MCP6444 (Microchip) - 3

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MCP6441/2/4 1.0 ELECTRICAL CHARACTERISTICS 1.1 Absolute Maximum Ratings †
VDD – VSS ..7.0V
† Notice:
Stresses above those listed under “Absolute Current at Input Pins ...±2 mA Maximum Ratings” may cause permanent damage to Analog Inputs (V the device. This is a stress rating only and functional IN+, VIN-)
††
.. VSS – 1.0V to VDD + 1.0V operation of the device at those or any other conditions All Other Inputs and Outputs ... VSS – 0.3V to VDD + 0.3V above those indicated in the operational listings of this Difference Input Voltage .. |VDD – VSS| specification is not implied. Exposure to maximum rat- Output Short-Circuit Current .. Continuous ing conditions for extended periods may affect device Current at Output and Supply Pins ..±30 mA reliability. Storage Temperature ..-65°C to +150°C
††
See
Section 4.1.2 “Input Voltage Limits”
. Maximum Junction Temperature (TJ).. +150°C ESD Protection on All Pins (HBM; MM) ... ≥ 4 kV; 200V
DC ELECTRICAL SPECIFICATIONS Electrical Characteristics
: Unless otherwise indicated, VDD = +1.4V to +6.0V, VSS= GND, TA= +25°C, VCM = VDD/2, V ≈ OUT VDD/2, VL = VDD/2 and RL = 1 MΩ to VL. (Refer to Figure 1-1).
Parameters Sym Min Typ Max Units Conditions Input Offset
Input Offset Voltage VOS -4.5 — +4.5 mV VCM = VSS Input Offset Drift with Temperature ΔVOS/ΔTA — ±2.5 — µV/°C TA= -40°C to +125°C, VCM = VSS Power Supply Rejection Ratio PSRR 65 86 — dB VCM = VSS
Input Bias Current and Impedance
Input Bias Current IB — ±1 — pA — 20 — pA TA = +85°C — 400 — pA TA = +125°C Input Offset Current IOS — ±1 — pA Common Mode Input Impedance ZCM — 1013||6 — Ω||pF Differential Input Impedance ZDIFF — 1013||6 — Ω||pF
Common Mode
Common Mode Input Voltage Range VCMR VSS-0.3 — VDD+0.3 V Common Mode Rejection Ratio CMRR 60 76 — dB VCM = -0.3V to 6.3V, VDD = 6.0V
Open-Loop Gain
DC Open-Loop Gain AOL 90 110 — dB VOUT = 0.1V to VDD-0.1V (Large Signal) RL = 10 kΩ to VL
Output
Maximum Output Voltage Swing VOL, VOH VSS+20 — VDD–20 mV VDD = 6.0V, RL = 10 kΩ 0.5V input overdrive Output Short-Circuit Current ISC — ±3 — mA VDD = 1.4V — ±22 — mA VDD = 6.0V
Power Supply
Supply Voltage VDD 1.4 — 6.0 V Quiescent Current per Amplifier IQ 250 450 650 nA IO = 0, VDD = 5.0V © 2010-2012 Microchip Technology Inc. DS22257C-page 3 Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 6.0V. FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 1.4V. FIGURE 2-5: Input Offset Voltage vs. Output Voltage. FIGURE 2-6: Input Offset Voltage vs. Power Supply Voltage. FIGURE 2-7: Input Noise Voltage Density vs. Frequency. FIGURE 2-8: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-9: CMRR, PSRR vs. Frequency. FIGURE 2-10: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-11: Input Bias, Offset Current vs. Ambient Temperature. FIGURE 2-12: Input Bias Current vs. Common Mode Input Voltage. FIGURE 2-13: Quiescent Current vs. Ambient Temperature. FIGURE 2-14: Quiescent Current vs. Power Supply Voltage. FIGURE 2-15: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-16: DC Open-Loop Gain vs. Power Supply Voltage. FIGURE 2-17: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-18: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-19: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-20: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-21: Output Voltage Swing vs. Frequency. FIGURE 2-22: Output Voltage Headroom vs. Output Current. FIGURE 2-23: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-24: Slew Rate vs. Ambient Temperature. FIGURE 2-25: Small Signal Non-Inverting Pulse Response. FIGURE 2-26: Small Signal Inverting Pulse Response. FIGURE 2-27: Large Signal Non-Inverting Pulse Response. FIGURE 2-28: Large Signal Inverting Pulse Response. FIGURE 2-29: The MCP6441/2/4 Device Shows No Phase Reversal. FIGURE 2-30: Closed Loop Output Impedance vs. Frequency. FIGURE 2-31: Measured Input Current vs. Input Voltage (below VSS). FIGURE 2-32: Channel-to-Channel Separation vs. Frequency (MCP6442/4 only). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 4.0 Application Information FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Protecting the Analog Inputs. FIGURE 4-4: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. FIGURE 4-6: Example Guard Ring Layout for Inverting Gain. FIGURE 4-7: Battery Current Sensing. FIGURE 4-8: Precision Half-Wave Rectifier. FIGURE 4-9: Two Op Amp Instrumentation Amplifier. 5.0 Design Aids 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service