link to page 9 link to page 9 link to page 9 Data SheetADA4807-1/ADA4807-2/ADA4807-4ABSOLUTE MAXIMUM RATINGSTHERMAL RESISTANCETable 5. ParameterRating θJA is specified for the worst case conditions, that is, a device Supply Voltage 11 V soldered in a circuit board for surface-mount packages. Internal Power Dissipation See Figure 5 Table 6. Thermal Resistance Input Voltage (Common Mode) ±VS ± 0.2 V Package TypeθJAUnit Differential Input Voltage ±1.4 V 6-Lead SC70, 4-Layer Board 209 °C/W Output Short-Circuit Duration See power 6-Lead SOT-23, 4-Layer Board 223 °C/W derating curves in Figure 5 8-Lead MSOP 123 °C/W Storage Temperature Range (All Packages) −65°C to +125°C 10-Lead LFCSP 51 °C/W Lead Temperature (Soldering 10 sec) 300°C 14-Lead TSSOP 130 °C/W Stresses at or above those listed under Absolute Maximum 4.0 Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these 3.5W) ( or any other conditions above those indicated in the operational 3.0 section of this specification is not implied. Operation beyond TION PA the maximum operating conditions for extended periods may 2.5ISSILFCSP affect product reliability. D 2.0ER WMAXIMUM POWER DISSIPATION1.5M PO The maximum power that can be safely dissipated by the MU 1.0 SOT-23TSSOPMSOP ADA4807-1/ADA4807-2/ADA4807-4 is limited by the associated XIMASC70 rise in junction temperature. The maximum safe junction 0.5 temperature for plastic encapsulated devices is determined by 0 the glass transition temperature of the plastic, approximately –40–25–105203550658095110125 003 1- 1 150°C. Exceeding this limit temporarily can cause a shift in AMBIENT TEMPERATURE (°C) 126 parametric performance due to a change in the stresses exerted Figure 5. Maximum Power Dissipation vs. Ambient Temperature for a 4-Layer Board on the die by the package. Exceeding a junction temperature of 175°C for an extended period can result in device failure. ESD CAUTION Although the ADA4807-1/ADA4807-2/ADA4807-4 are internally short-circuit protected, this may not be sufficient to guarantee that the maximum junction temperature (150°C) is not exceeded under al conditions. To ensure proper operation, it is necessary to observe the power derating curves shown in Figure 5. Rev. B | Page 9 of 33 Document Outline FEATURES APPLICATIONS PIN CONNECTION DIAGRAMS GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ±5 V SUPPLY 5 V SUPPLY 3 V SUPPLY ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS FREQUENCY RESPONSE FREQUENCY AND SUPPLY CURRENT DC AND INPUT COMMON-MODE PERFORMANCE SLEW, TRANSIENT, SETTLING TIME, AND CROSSTALK DISTORTION AND NOISE OUTPUT CHARACTERISTICS OVERDRIVE RECOVERY AND TURN ON/TURN OFF TIMES THEORY OF OPERATION DISABLE CIRCUITRY INPUT PROTECTION NOISE CONSIDERATIONS APPLICATIONS INFORMATION CAPACITIVE LOAD DRIVE LOW NOISE FET OPERATIONAL AMPLIFIER POWER MODE ADC DRIVER ADC DRIVING ADC DRIVING WITH DYNAMIC POWER SCALING LAYOUT, GROUNDING, AND BYPASSING OUTLINE DIMENSIONS ORDERING GUIDE