Datasheet Nexperia BUK7S0R5-40H — Ficha de datos

BUK7S0R5-40H N-channel 40 V, 0.5 mOhm standard level MOSFET in
LFPAK88
6 April 2021 Product data sheet 1. General description
Automotive qualified N-channel MOSFET using the latest Trench 9 low ohmic superjunction
technology, housed in a copper-clip LFPAK88 package. This product has been fully designed and
qualified to meet beyond AEC-Q101 requirements delivering high performance and reliability. 2. Features and benefits
•
• • • • Fully automotive qualified to beyond AEC-Q101:
• -55 °C to +175 °C rating suitable for thermally demanding environments
LFPAK88 package:
• Designed for smaller footprint and improved power density over older wire bond packages
such as D²PAK for today’s space constrained high power automotive applications
• Thin package and copper clip enables LFPAK88 to be highly efficient thermally
LFPAK copper clip technology enabling improvements over wire bond packages by:
• Increased maximum current capability and excellent current spreading
• Improved RDSon
• Low source inductance
• Low thermal resistance Rth
LFPAK Gull Wing leads:
• Flexible leads enabling high Board Level Reliability absorbing mechanical and thermal
cycling stress, unlike traditional QFN packages
• Visual (AOI) soldering inspection, no need for expensive x-ray equipment
• Easy solder wetting for good mechanical solder joint …