Plastic Packages for Integrated Circuits Package Outline Drawing
L8.2x3B
8 LEAD EXTREME THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (XDFN)
Rev 2, 05/15
0 . 50 BSC 2 . 00 BSC 4 b A
1 B 0.10 M C A B 4 6 PIN 1 INDEX AREA 0.15 8 0.4 В± 0.1 (4X) 3 . 00 BSC 6 1.45 + 0.1/ -0.15 PIN 1 INDEX AREA TOP VIEW 5
1.35+0.1/ -0.15 BOTTOM VIEW
PACKAGE OUTLINE
( 6 x 0.50 BSC )
( 8 x 0.25 ) DETAIL "X"
0.10 C C 0.31 ~ 0.40
SEATING
PLANE
0.08 C ( 1.45 ) SIDE VIEW ( 1.35 ) TYPICAL RECOMMENDED LAND PATTERN 0 . 127 REF 0 . 00 MIN.
0 . 05 MAX. ( 8 X 0.60 ) ( 8 x 0.20 ) C DETAIL "X" NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal В± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.18mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature and may
be located on any of the 4 sides (or ends). …
