Package Intersil W8x8.64 — Ficha de datos

FabricanteIntersil
SerieWLCSP
Numero de parteW8x8.64
Package Intersil W8x8.64

8x8 Array 64 Balls Wafer Level Chip Scale Package

Package Outline Drawing (POD)

PDF, 116 Kb
Extracto del documento

Paramétricos

FamilyWLCSP-TCURDL
Pin Count64
Length4.03 mm
Width4.03 mm
Thickness0.60 mm
Height max0.66 mm
Pitch0.50 mm
Lead Free Peak Temperature260 °C
Package IndexW8X8.64

Linea modelo

Clasificación del fabricante

  • Plastic Packages