Plastic Packages for Integrated Circuits
Thin Shrink Small Outline Package Family (TSSOP)
MDP0044 0.25 M C A B
D THIN SHRINK SMALL OUTLINE PACKAGE FAMILY A
(N/2)+1 N MILLIMETERS
SYMBOL 14 LD 16 LD 20 LD 24 LD 28 LD TOLERANCE
PIN #1 I.D. E E1 1 (N/2) B 0.20 C B A
2X
N/2 LEAD TIPS TOP VIEW 0.05 e C
SEATING
PLANE H A 1.20 1.20 1.20 1.20 1.20 Max A1 0.10 0.10 0.10 0.10 0.10 В±0.05 A2 0.90 0.90 0.90 0.90 0.90 В±0.05 b 0.25 0.25 0.25 0.25 0.25 +0.05/-0.06 c 0.15 0.15 0.15 0.15 0.15 +0.05/-0.06 D 5.00 5.00 6.50 7.80 9.70 В±0.10 E 6.40 6.40 6.40 6.40 6.40 Basic E1 4.40 4.40 4.40 4.40 4.40 В±0.10 e 0.65 0.65 0.65 0.65 0.65 Basic L 0.60 0.60 0.60 0.60 0.60 В±0.15 L1 1.00 1.00 1.00 1.00 1.00 Reference
Rev. F 2/07 0.10 M C A B b
0.10 C
N LEADS SIDE VIEW NOTES:
1. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
2. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm per
side. SEE DETAIL “X” 3. Dimensions “D” and “E1” are measured at dAtum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994. c END VIEW L1 A A2
GAUGE
PLANE …
