Plastic Packages for Integrated Circuits
Thin Plastic Quad Flatpack Packages (TQFP)
Q32.7x7 (JEDEC MS-026ABA ISSUE B)
32 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE
INCHES D
D1
-D-B-A-E E1 e
PIN 1
SEATING
A PLANE -H-0.08
0.003
-C-MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A -0.047 -1.20 -A1 0.002 0.005 0.05 0.15 -A2 0.038 0.041 0.95 1.05 -b 0.012 0.018 0.30 0.45 6 b1 0.012 0.016 0.30 0.40 -D 0.350 0.358 8.90 9.10 3 D1 0.272 0.280 6.90 7.10 4, 5 E 0.350 0.358 8.90 9.10 3 E1 0.272 0.280 6.90 7.10 4, 5 L 0.018 0.029 0.45 0.75 N 32 32 e 0.031 BSC 0.80 BSC 7
Rev. 0 10/06 NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane -C-. 0.08
0.003 M D S C A-B S b 11o-13o
0.020
0.008 MIN b1 0o MIN
A2 A1 GAGE
PLANE 0o-7o 0.25
0.010 11o-13o 1 5. Dimensions D1 and E1 do not include mold protrusion. …
