Package Intersil V256.13.5x13.5 — Ficha de datos
256 paquete de matriz de rejilla de bola de plástico de paso fino de perfil bajo
Package Outline Drawing (POD)
Paramétricos
Family | LFBGA |
Pin Count | 256 |
Height max | 1.70 mm |
Weight | 0.722 g |
Pitch | 0.80 mm |
Peak Temperature | 235 °C |
Lead Free Peak Temperature | 260 °C |
Features | Low Profile, Fine |
Package Index | V256.13.5X13.5 |
Linea modelo
Serie: BGA (14)
Clasificación del fabricante
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