Datasheet Texas Instruments TMS320C6671 — Ficha de datos
Fabricante | Texas Instruments |
Serie | TMS320C6671 |
Procesador de señal digital de punto fijo y flotante
Hojas de datos
TMS320C6671 Fixed and Floating-Point Digital Signal Processor datasheet
PDF, 2.1 Mb, Revisión: E, Archivo publicado: mayo 7, 2014
Extracto del documento
Precios
Estado
TMS320C6671ACYP | TMS320C6671ACYP25 | TMS320C6671ACYPA | TMS320C6671ACYPA25 | |
---|---|---|---|---|
Estado del ciclo de vida | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) |
Disponibilidad de muestra del fabricante | No | Sí | Sí | No |
Embalaje
TMS320C6671ACYP | TMS320C6671ACYP25 | TMS320C6671ACYPA | TMS320C6671ACYPA25 | |
---|---|---|---|---|
N | 1 | 2 | 3 | 4 |
Pin | 841 | 841 | 841 | 841 |
Package Type | CYP | CYP | CYP | CYP |
Package QTY | 44 | 44 | 44 | 44 |
Carrier | JEDEC TRAY (5+1) | |||
Device Marking | TMS320C6671CYP | 1.25GHZ | TMS320C6671CYP | A1.25GHZ |
Width (mm) | 24 | 24 | 24 | 24 |
Length (mm) | 24 | 24 | 24 | 24 |
Thickness (mm) | 2.82 | 2.82 | 2.82 | 2.82 |
Mechanical Data | Descargar | Descargar | Descargar | Descargar |
Paramétricos
Parameters / Models | TMS320C6671ACYP | TMS320C6671ACYP25 | TMS320C6671ACYPA | TMS320C6671ACYPA25 |
---|---|---|---|---|
Applications | Communications and Telecom | Communications and Telecom | Communications and Telecom | Communications and Telecom |
DRAM | DDR3 | DDR3 | DDR3 | DDR3 |
DSP | 1 C66x | 1 C66x | 1 C66x | 1 C66x |
DSP MHz, Max. | 1000,1250 | 1000,1250 | 1000,1250 | 1000,1250 |
EMAC | 2-Port 1Gb Switch | 2-Port 1Gb Switch | 2-Port 1Gb Switch | 2-Port 1Gb Switch |
GFLOPS | 16,20 | 16,20 | 16,20 | 16,20 |
On-Chip L2 Cache | 512 KB | 512 KB | 512 KB | 512 KB |
Operating Temperature Range, C | -40 to 100,0 to 85 | -40 to 100,0 to 85 | -40 to 100,0 to 85 | -40 to 100,0 to 85 |
Other On-Chip Memory | 4096 KB | 4096 KB | 4096 KB | 4096 KB |
PCI/PCIe | 2 PCIe Gen2 | 2 PCIe Gen2 | 2 PCIe Gen2 | 2 PCIe Gen2 |
Package Size: mm2:W x L, PKG | See datasheet (FCBGA) | See datasheet (FCBGA) | See datasheet (FCBGA) | See datasheet (FCBGA) |
Rating | Catalog | Catalog | Catalog | Catalog |
Serial I/O | I2C,RapidIO,SPI,TSIP,UART | I2C,RapidIO,SPI,TSIP,UART | I2C,RapidIO,SPI,TSIP,UART | I2C,RapidIO,SPI,TSIP,UART |
Serial RapidIO | 1 (four lanes) | 1 (four lanes) | 1 (four lanes) | 1 (four lanes) |
Total On-Chip Memory, KB | 4800 | 4800 | 4800 | 4800 |
Plan ecológico
TMS320C6671ACYP | TMS320C6671ACYP25 | TMS320C6671ACYPA | TMS320C6671ACYPA25 | |
---|---|---|---|---|
RoHS | Obediente | Obediente | Obediente | Obediente |
Notas de aplicación
- TI Keystone DSP Hyperlink SerDes IBIS-AMI ModelsPDF, 3.2 Mb, Archivo publicado: oct 9, 2014
This document describes the organization, structure, and proper usage of the TI serializer and deserializer (SerDes) IBIS-AMI models for Keystone DSP Hyperlink interface. - TI Keystone DSP PCIe SerDes IBIS-AMI ModelsPDF, 4.8 Mb, Archivo publicado: oct 9, 2014
This document describes the organization, structure, and proper usage of the TI serializer and deserializer (SerDes) IBIS-AMI models for Keystone DSP PCIe interface. - SerDes Implementation Guidelines for KeyStone I DevicesPDF, 590 Kb, Archivo publicado: oct 31, 2012
The goal of KeyStone I SerDes collateral material is to make system implementation easier for the customer by providing the system solution. For these SerDes-based interfaces, it is not assumed that the system designer is familiar with the industry specifications, SerDes technology, or RF/microwave PCB design. However, it is still expected that the PCB design work will be supervised by a knowledge - KeyStone I DDR3 Initialization (Rev. E)PDF, 114 Kb, Revisión: E, Archivo publicado: oct 28, 2016
The initialization of the DDR3 DRAM controller on KeyStone I DSPs is straightforward as long as the proper steps are followed. However, if some steps are omitted or if some sequence-sensitive steps are implemented in the wrong order, DDR3 operation will be unpredictable.All DDR3 initialization routines must contain the basic register writes to configure the memory controller within the DSP - TMS320C66x DSP Generation of Devices (Rev. A)PDF, 245 Kb, Revisión: A, Archivo publicado: abr 25, 2011
- Hardware Design Guide for KeyStone Devices (Rev. C)PDF, 1.7 Mb, Revisión: C, Archivo publicado: sept 15, 2013
- SERDES Link Commissioning on KeyStone I and II DevicesPDF, 138 Kb, Archivo publicado: abr 13, 2016
The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices. - PCIe Use Cases for KeyStone DevicesPDF, 320 Kb, Archivo publicado: dic 13, 2011
- Clocking Design Guide for KeyStone DevicesPDF, 1.5 Mb, Archivo publicado: nov 9, 2010
- The C6000 Embedded Application Binary Interface Migration Guide (Rev. A)PDF, 20 Kb, Revisión: A, Archivo publicado: nov 10, 2010
The C6000 compiler tools support a new ELF-based ABI named EABI. Prior to this time, the compiler only supported a single ABI, which is now named COFF ABI. The following compelling best-in-class features are available under the C6000 EABI:GeneralZero-init globals: “int gvar;” gets set to 0 before main runs.Dynamic linking: Add code to a running system.Native ROM - Optimizing Loops on the C66x DSPPDF, 585 Kb, Archivo publicado: nov 9, 2010
- DDR3 Design Requirements for KeyStone Devices (Rev. B)PDF, 582 Kb, Revisión: B, Archivo publicado: jun 5, 2014
- Multicore Programming Guide (Rev. B)PDF, 1.8 Mb, Revisión: B, Archivo publicado: agosto 29, 2012
As application complexity continues to grow, we have reached a limit on increasing performance by merely scaling clock speed. To meet the ever-increasing processing demand, modern System-On-Chip solutions contain multiple processing cores. The dilemma is how to map applications to multicore devices. In this paper, we present a programming methodology for converting applications to run on multicore - Thermal Design Guide for DSP and ARM Application Processors (Rev. A)PDF, 324 Kb, Revisión: A, Archivo publicado: agosto 17, 2016
This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
Linea modelo
Serie: TMS320C6671 (4)
Clasificación del fabricante
- Semiconductors> Processors> Digital Signal Processors> C6000 DSP> C66x DSP