Datasheet Texas Instruments TMS320C6652 — Ficha de datos
Fabricante | Texas Instruments |
Serie | TMS320C6652 |
Procesador de señal digital de punto fijo y flotante
Hojas de datos
TMS320C6652 and TMS320C6654 Fixed and Floating-Point Digital Signal Processor datasheet
PDF, 1.7 Mb, Revisión: D, Archivo publicado: jun 22, 2016
Extracto del documento
Precios
Estado
TMS320C6652CZH6 | TMS320C6652CZHA6 | |
---|---|---|
Estado del ciclo de vida | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) |
Disponibilidad de muestra del fabricante | No | No |
Embalaje
TMS320C6652CZH6 | TMS320C6652CZHA6 | |
---|---|---|
N | 1 | 2 |
Pin | 625 | 625 |
Package Type | CZH | CZH |
Package QTY | 1 | 1 |
Carrier | NOT REQUIRED | NOT REQUIRED |
Device Marking | TMS320C6652CZH | @2012 TI |
Width (mm) | 21 | 21 |
Length (mm) | 21 | 21 |
Thickness (mm) | 2.42 | 2.42 |
Mechanical Data | Descargar | Descargar |
Paramétricos
Parameters / Models | TMS320C6652CZH6 | TMS320C6652CZHA6 |
---|---|---|
Applications | Machine Vision | Machine Vision |
DRAM | DDR3 | DDR3 |
DSP | 1 C66x | 1 C66x |
DSP MHz, Max. | 600 | 600 |
GFLOPS | 9.6 | 9.6 |
On-Chip L2 Cache | 1024 KB | 1024 KB |
Operating Temperature Range, C | -40 to 100,0 to 85 | -40 to 100,0 to 85 |
Other On-Chip Memory | 1024 KB | 1024 KB |
Package Size: mm2:W x L, PKG | See datasheet (FCBGA) | See datasheet (FCBGA) |
Rating | Catalog | Catalog |
Serial I/O | I2C,SPI,UART,UPP | I2C,SPI,UART,UPP |
Total On-Chip Memory, KB | 1088 | 1088 |
Plan ecológico
TMS320C6652CZH6 | TMS320C6652CZHA6 | |
---|---|---|
RoHS | Obediente | Obediente |
Notas de aplicación
- Hardware Design Guide for KeyStone Devices (Rev. C)PDF, 1.7 Mb, Revisión: C, Archivo publicado: sept 15, 2013
- TMS320C66x DSP Generation of Devices (Rev. A)PDF, 245 Kb, Revisión: A, Archivo publicado: abr 25, 2011
- KeyStone I DDR3 Initialization (Rev. E)PDF, 114 Kb, Revisión: E, Archivo publicado: oct 28, 2016
The initialization of the DDR3 DRAM controller on KeyStone I DSPs is straightforward as long as the proper steps are followed. However, if some steps are omitted or if some sequence-sensitive steps are implemented in the wrong order, DDR3 operation will be unpredictable.All DDR3 initialization routines must contain the basic register writes to configure the memory controller within the DSP - AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)PDF, 2.2 Mb, Revisión: A, Archivo publicado: mayo 1, 2004
Application Note 1281 Bumped Die (Flip Chip) Packages - Clocking Design Guide for KeyStone DevicesPDF, 1.5 Mb, Archivo publicado: nov 9, 2010
- The C6000 Embedded Application Binary Interface Migration Guide (Rev. A)PDF, 20 Kb, Revisión: A, Archivo publicado: nov 10, 2010
The C6000 compiler tools support a new ELF-based ABI named EABI. Prior to this time, the compiler only supported a single ABI, which is now named COFF ABI. The following compelling best-in-class features are available under the C6000 EABI:GeneralZero-init globals: “int gvar;” gets set to 0 before main runs.Dynamic linking: Add code to a running system.Native ROM - Optimizing Loops on the C66x DSPPDF, 585 Kb, Archivo publicado: nov 9, 2010
- DDR3 Design Requirements for KeyStone Devices (Rev. B)PDF, 582 Kb, Revisión: B, Archivo publicado: jun 5, 2014
- TI DSP BenchmarkingPDF, 62 Kb, Archivo publicado: enero 13, 2016
This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms. - Thermal Design Guide for DSP and ARM Application Processors (Rev. A)PDF, 324 Kb, Revisión: A, Archivo publicado: agosto 17, 2016
This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require - Plastic Ball Grid Array [PBGA] Application Note (Rev. B)PDF, 1.6 Mb, Revisión: B, Archivo publicado: agosto 13, 2015
Linea modelo
Serie: TMS320C6652 (2)
Clasificación del fabricante
- Semiconductors> Processors> Digital Signal Processors> C6000 DSP> C66x DSP