Datasheet Texas Instruments TMP006 — Ficha de datos
Fabricante | Texas Instruments |
Serie | TMP006 |
Sensor de temperatura sin contacto de termopila infrarroja en paquete WCSP
Hojas de datos
TMP006/B Infrared Thermopile Sensor in Chip-Scale Package datasheet
PDF, 725 Kb, Revisión: E, Archivo publicado: abr 9, 2015
Precios
Estado
HPA01108AIYZFR | TMP006AIYZFR | TMP006AIYZFT | TMP006BIYZFR | TMP006BIYZFT | |
---|---|---|---|---|---|
Estado del ciclo de vida | NRND (No recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) |
Disponibilidad de muestra del fabricante | No | Sí | No | Sí | No |
Embalaje
HPA01108AIYZFR | TMP006AIYZFR | TMP006AIYZFT | TMP006BIYZFR | TMP006BIYZFT | |
---|---|---|---|---|---|
N | 1 | 2 | 3 | 4 | 5 |
Pin | 8 | 8 | 8 | 8 | 8 |
Package Type | YZF | YZF | YZF | YZF | YZF |
Industry STD Term | DSBGA | DSBGA | DSBGA | DSBGA | DSBGA |
JEDEC Code | S-XBGA-N | S-XBGA-N | S-XBGA-N | S-XBGA-N | S-XBGA-N |
Package QTY | 3000 | 3000 | 250 | 3000 | 250 |
Carrier | LARGE T&R | LARGE T&R | SMALL T&R | LARGE T&R | SMALL T&R |
Device Marking | TMP006 | TMP006 | TMP006 | T006B | T006B |
Width (mm) | 1.75 | 1.75 | 1.75 | 1.75 | 1.75 |
Length (mm) | 1.75 | 1.75 | 1.75 | 1.75 | 1.75 |
Pitch (mm) | .5 | .5 | .5 | .5 | .5 |
Max Height (mm) | .625 | .625 | .625 | .625 | .625 |
Mechanical Data | Descargar | Descargar | Descargar | Descargar | Descargar |
Paramétricos
Parameters / Models | HPA01108AIYZFR | TMP006AIYZFR | TMP006AIYZFT | TMP006BIYZFR | TMP006BIYZFT |
---|---|---|---|---|---|
Approx. Price (US$) | 1.50 | 1ku | 1.50 | 1ku | 1.50 | 1ku | 1.50 | 1ku | |
Infrared Sensor Accuracy(Max)(+/- C) | 3 | 3 | 3 | 3 | |
Interface | I2C SMBus 2-Wire | I2C SMBus 2-Wire | I2C SMBus 2-Wire | I2C SMBus 2-Wire | |
Local Sensor Accuracy(Max)(+/- C) | 1 | 1 | 1 | 1 | |
Operating Temperature Range(C) | -40 to 125 | -40 to 125 | -40 to 125 | -40 to 125 | |
Package Group | DSBGA | DSBGA | DSBGA | DSBGA | |
Special Features | Shutdown | Shutdown | Shutdown | Shutdown | |
Supply Current(Typ)(uA) | 240 | 240 | 240 | 240 | |
Supply Voltage(Max)(V) | 5.5V | 5.5V | 5.5V | 5.5V | |
Supply Voltage(Min)(V) | 2.2 | 2.2 | 2.2 | 2.2 | |
Temp Range for Listed Accuracy(C) | 0 to 60 | 0 to 60 | 0 to 60 | 0 to 60 | |
Temp Resolution(Max)(bits) | 14 | 14 | 14 | 14 |
Plan ecológico
HPA01108AIYZFR | TMP006AIYZFR | TMP006AIYZFT | TMP006BIYZFR | TMP006BIYZFT | |
---|---|---|---|---|---|
RoHS | Obediente | Obediente | Obediente | Obediente | Obediente |
Pb gratis | Sí | Sí | Sí | Sí |
Notas de aplicación
- TMP006 and TMP007: Through-Hole Mounting MethodPDF, 1.8 Mb, Archivo publicado: sept 1, 2016
This applicationnotedescribesa new methodof mountingTMP007WCSPdie on the printed-circuitboard(PCB).The advantagesof the new methodare describedand mountingrecommendationsare provided.All of the followingrecommendationsand conclusionsare also true for TMP006parts. - AN-1112 DSBGA Wafer Level Chip Scale Package (Rev. AG)PDF, 13.7 Mb, Revisión: AG, Archivo publicado: agosto 12, 2015
- Understanding the I2C BusPDF, 124 Kb, Archivo publicado: jun 30, 2015
Linea modelo
Serie: TMP006 (5)
Clasificación del fabricante
- Semiconductors> Sensing Products> Temperature Sensors> IR & Probe Temperature Sensors