Datasheet Texas Instruments SN74V293 — Ficha de datos

Fabricante	Texas Instruments
Serie	SN74V293

Memoria FIFO síncrona 65536 x 18

Hojas de datos

PDF, 818 Kb, Revisión: D, Archivo publicado: feb 12, 2003

Extracto del documento

	SN74V293-10PZA	SN74V293-15PZA	SN74V293-15PZAG4	SN74V293-6PZA	SN74V293-7PZA
Estado del ciclo de vida	Activo (Recomendado para nuevos diseños)	Activo (Recomendado para nuevos diseños)	Activo (Recomendado para nuevos diseños)	Activo (Recomendado para nuevos diseños)	Activo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricante	No	No	No	No	No

	SN74V293-10PZA	SN74V293-15PZA	SN74V293-15PZAG4	SN74V293-6PZA	SN74V293-7PZA
N	1	2	3	4	5
Pin	80	80	80	80	80
Package Type	PZA	PZA	PZA	PZA	PZA
Industry STD Term	LQFP	LQFP	LQFP	LQFP	LQFP
JEDEC Code	S-PQFP-G	S-PQFP-G	S-PQFP-G	S-PQFP-G	S-PQFP-G
Package QTY	90	90	90	90	90
Carrier	JEDEC TRAY (5+1)	JEDEC TRAY (5+1)	JEDEC TRAY (5+1)	JEDEC TRAY (5+1)	JEDEC TRAY (5+1)
Device Marking	V293-10	V293-15	V293-15	V293-6	V293-7
Width (mm)	14	14	14	14	14
Length (mm)	14	14	14	14	14
Thickness (mm)	1.4	1.4	1.4	1.4	1.4
Pitch (mm)	.65	.65	.65	.65	.65
Max Height (mm)	1.6	1.6	1.6	1.6	1.6
Mechanical Data	Descargar	Descargar	Descargar	Descargar	Descargar

Parameters / Models	SN74V293-10PZA	SN74V293-15PZA	SN74V293-15PZAG4	SN74V293-6PZA	SN74V293-7PZA
Package Group	LQFP	LQFP	LQFP	LQFP	LQFP
Package Size: mm2:W x L, PKG	80LQFP: 256 mm2: 16 x 16(LQFP)	80LQFP: 256 mm2: 16 x 16(LQFP)	80LQFP: 256 mm2: 16 x 16(LQFP)	80LQFP: 256 mm2: 16 x 16(LQFP)	80LQFP: 256 mm2: 16 x 16(LQFP)
Schmitt Trigger	No	No	No	No	No

	SN74V293-10PZA	SN74V293-15PZA	SN74V293-15PZAG4	SN74V293-6PZA	SN74V293-7PZA
RoHS	Obediente	Obediente	Obediente	Obediente	Obediente

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Design Considerations of SN74V293 FIFO in a MicroStar BGA(TM) Package (Rev. A)
PDF, 112 Kb, Revisión: A, Archivo publicado: abr 10, 2002
Texas Instruments? near-chip-scale MicroSTAR BGA? package is gaining in popularity for applications where board space and/or weight are significant design factors. However, no less-significant design factors are those associated with electronic coupling between signal paths when leading-edge high-speed digital signals are closely spaced.With a few simple routing and trace-location consideratio
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Power-Dissipation Calculations for TI FIFO Products (Rev. A)
PDF, 106 Kb, Revisión: A, Archivo publicado: marzo 1, 1996
Low power consumption is a major advantage of TI FIFO products. Power calculations are required to meet design requirements for chip temperature and system power. This document assists component and system designers in evaluating power consumption for the ACT and ABT FIFO products. Two examples of power calculations, one for the SN74ACT3632 bi-directional CMOS FIFO and one for the BiCMOS SN74ABT36

Serie: SN74V293 (5)