Datasheet Texas Instruments SN54LS674 — Ficha de datos

Fabricante	Texas Instruments
Serie	SN54LS674

Hojas de datos

Precios

Estado

Embalaje

Paramétricos

Parameters / Models	5962-88607013A	5962-8860701JA	SN54LS674J	SNJ54LS674FK	SNJ54LS674J
3-State Output	No	No	No	No	No
Bits	16	16	16	16	16
F @ Nom Voltage(Max), Mhz	35	35	35	35	35
ICC @ Nom Voltage(Max), mA	40	40	40	40	40
Input Type	TTL	TTL	TTL	TTL	TTL
Operating Temperature Range, C	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125
Output Drive (IOL/IOH)(Max), mA	24/-2.6	24/-2.6	24/-2.6	24/-2.6	24/-2.6
Output Type	TTL	TTL	TTL	TTL	TTL
Package Group	LCCC	CDIP	CDIP	LCCC	CDIP
Package Size: mm2:W x L, PKG	28LCCC: 131 mm2: 11.43 x 11.43(LCCC)	See datasheet (CDIP)	See datasheet (CDIP)	28LCCC: 131 mm2: 11.43 x 11.43(LCCC)	See datasheet (CDIP)
Rating	Military	Military	Military	Military	Military
Technology Family	LS	LS	LS	LS	LS
VCC(Max), V	5.25	5.25	5.25	5.25	5.25
VCC(Min), V	4.75	4.75	4.75	4.75	4.75
tpd @ Nom Voltage(Max), ns	40	40	40	40	40

Plan ecológico

Notas de aplicación

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  Input and Output Characteristics of Digital Integrated Circuits
  PDF, 1.7 Mb, Archivo publicado: oct 1, 1996
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  TI IBIS File Creation Validation and Distribution Processes
  PDF, 380 Kb, Archivo publicado: agosto 29, 2002
  The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
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  Live Insertion
  PDF, 150 Kb, Archivo publicado: oct 1, 1996
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  PDF, 614 Kb, Revisión: C, Archivo publicado: dic 2, 2015
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  PDF, 337 Kb, Archivo publicado: jul 8, 2004
  Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
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  PDF, 186 Kb, Revisión: C, Archivo publicado: jun 1, 1997
  Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
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  PDF, 118 Kb, Revisión: A, Archivo publicado: marzo 1, 1997
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• Descargar
  Introduction to Logic
  PDF, 93 Kb, Archivo publicado: abr 30, 2015

Linea modelo

Clasificación del fabricante

• Semiconductors> Space & High Reliability> Logic Products> Flip-Flop/Latch/Registers