Datasheet Texas Instruments SN54LS06 — Ficha de datos
| Fabricante | Texas Instruments |
| Serie | SN54LS06 |
Buffers / controladores de inversor hexagonal con salidas de alto voltaje de colector abierto
Hojas de datos
SNx4LS06 Hex Inverter Buffers and Drivers With Open-Collector High-Voltage Outputs datasheet
PDF, 1.3 Mb, Revisión: F, Archivo publicado: jul 29, 2016
Extracto del documento
Precios
Estado
| 5962-9861701Q2A | 5962-9861701QCA | SN54LS06J | SNJ54LS06FK | SNJ54LS06J | |
|---|---|---|---|---|---|
| Estado del ciclo de vida | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) |
| Disponibilidad de muestra del fabricante | No | No | No | No | No |
Embalaje
| 5962-9861701Q2A | 5962-9861701QCA | SN54LS06J | SNJ54LS06FK | SNJ54LS06J | |
|---|---|---|---|---|---|
| N | 1 | 2 | 3 | 4 | 5 |
| Pin | 20 | 14 | 14 | 20 | 14 |
| Package Type | FK | J | J | FK | J |
| Industry STD Term | LCCC | CDIP | CDIP | LCCC | CDIP |
| JEDEC Code | S-CQCC-N | R-GDIP-T | R-GDIP-T | S-CQCC-N | R-GDIP-T |
| Package QTY | 1 | 1 | 1 | 1 | 1 |
| Carrier | TUBE | TUBE | TUBE | TUBE | TUBE |
| Device Marking | SNJ54LS | SNJ54LS06J | SN54LS06J | 06FK | SNJ54LS06J |
| Width (mm) | 8.89 | 6.67 | 6.67 | 8.89 | 6.67 |
| Length (mm) | 8.89 | 19.56 | 19.56 | 8.89 | 19.56 |
| Thickness (mm) | 1.83 | 4.57 | 4.57 | 1.83 | 4.57 |
| Pitch (mm) | 1.27 | 2.54 | 2.54 | 1.27 | 2.54 |
| Max Height (mm) | 2.03 | 5.08 | 5.08 | 2.03 | 5.08 |
| Mechanical Data | Descargar | Descargar | Descargar | Descargar | Descargar |
Paramétricos
| Parameters / Models | 5962-9861701Q2A | 5962-9861701QCA | SN54LS06J | SNJ54LS06FK | SNJ54LS06J |
|---|---|---|---|---|---|
| Bits | 6 | 6 | 6 | 6 | 6 |
| Input Type | TTL | TTL | TTL | TTL | TTL |
| Operating Temperature Range, C | -55 to 125 | -55 to 125 | -55 to 125 | -55 to 125 | -55 to 125 |
| Output Type | TTL | TTL | TTL | TTL | TTL |
| Package Group | LCCC | CDIP | CDIP | LCCC | CDIP |
| Package Size: mm2:W x L, PKG | 20LCCC: 79 mm2: 8.89 x 8.89(LCCC) | See datasheet (CDIP) | See datasheet (CDIP) | 20LCCC: 79 mm2: 8.89 x 8.89(LCCC) | See datasheet (CDIP) |
| Rating | Military | Military | Military | Military | Military |
| Schmitt Trigger | No | No | No | No | No |
| Technology Family | LS | LS | LS | LS | LS |
| VCC(Max), V | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 |
| VCC(Min), V | 4.5 | 4.5 | 4.5 | 4.5 | 4.5 |
| Voltage(Nom), V | 5 | 5 | 5 | 5 | 5 |
Plan ecológico
| 5962-9861701Q2A | 5962-9861701QCA | SN54LS06J | SNJ54LS06FK | SNJ54LS06J | |
|---|---|---|---|---|---|
| RoHS | See ti.com | See ti.com | See ti.com | See ti.com | See ti.com |
Notas de aplicación
- Designing with the SN54/74LS123 (Rev. A)PDF, 118 Kb, Revisión: A, Archivo publicado: marzo 1, 1997
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This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou - TI IBIS File Creation Validation and Distribution ProcessesPDF, 380 Kb, Archivo publicado: agosto 29, 2002
The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con - Live InsertionPDF, 150 Kb, Archivo publicado: oct 1, 1996
Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha - Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)PDF, 614 Kb, Revisión: C, Archivo publicado: dic 2, 2015
- Semiconductor Packing Material Electrostatic Discharge (ESD) ProtectionPDF, 337 Kb, Archivo publicado: jul 8, 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge - Designing With Logic (Rev. C)PDF, 186 Kb, Revisión: C, Archivo publicado: jun 1, 1997
Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w - Introduction to LogicPDF, 93 Kb, Archivo publicado: abr 30, 2015
Linea modelo
Serie: SN54LS06 (5)
Clasificación del fabricante
- Semiconductors> Space & High Reliability> Logic Products> Buffers/Drivers/Transceivers> Buffer Drivers