Datasheet Texas Instruments 5962-9759001Q2A — Ficha de datos

FabricanteTexas Instruments
SerieSN54F374
Numero de parte5962-9759001Q2A
Datasheet Texas Instruments 5962-9759001Q2A

Chanclas de tipo D activadas por borde octal con salidas de 3 estados 20-LCCC -55 a 125

Hojas de datos

Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs datasheet
PDF, 1.3 Mb, Revisión: A, Archivo publicado: oct 1, 1993
Extracto del documento

Precios

Estado

Estado del ciclo de vidaActivo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricanteNo

Embalaje

Pin20202020
Package TypeFKFKFKFK
Industry STD TermLCCCLCCCLCCCLCCC
JEDEC CodeS-CQCC-NS-CQCC-NS-CQCC-NS-CQCC-N
Package QTY1111
CarrierTUBETUBETUBETUBE
Device Marking5962-9759001Q2A374FKSNJ54F
Width (mm)8.898.898.898.89
Length (mm)8.898.898.898.89
Thickness (mm)1.831.831.831.83
Pitch (mm)1.271.271.271.27
Max Height (mm)2.032.032.032.03
Mechanical DataDescargarDescargarDescargarDescargar

Paramétricos

3-State OutputYes
Bits8
F @ Nom Voltage(Max)70 Mhz
ICC @ Nom Voltage(Max)86 mA
Input TypeTTL
Operating Temperature Range-55 to 125 C
Output Drive (IOL/IOH)(Max)24/-3 mA
Output TypeTTL
Package GroupLCCC
Package Size: mm2:W x L20LCCC: 79 mm2: 8.89 x 8.89(LCCC) PKG
RatingMilitary
Technology FamilyF
VCC(Max)5.5 V
VCC(Min)4.5 V
tpd @ Nom Voltage(Max)10 ns

Plan ecológico

RoHSSee ti.com

Notas de aplicación

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    PDF, 380 Kb, Archivo publicado: agosto 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
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    PDF, 105 Kb, Revisión: A, Archivo publicado: agosto 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
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  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, Archivo publicado: jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revisión: C, Archivo publicado: jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
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    PDF, 93 Kb, Archivo publicado: abr 30, 2015

Linea modelo

Clasificación del fabricante

  • Semiconductors > Space & High Reliability > Logic Products > Flip-Flop/Latch/Registers

Otros nombres:

59629759001Q2A, 5962 9759001Q2A